Candela 8520 High Sensitivity High Throughput Wafer Inspection Tool
Description
The Candela® 8520 2nd generation integrated surface and photoluminescence inspection system is designed for advanced characterization of substrate and epitaxial defects for the power device market and related applications. Implementation of automated wafer inspection with statistical process control (SPC) methodology can significantly cut yield loss due to epi defects, minimize metal-organic chemical vapor deposition (MOCVD) reactor process excursions, and increase MOCVD reactor uptime. The Candela 8520 is the successor to the Candela CS920, which was the first of its kind to integrate macro/micro detection for surface and crystal defects in a unified inspection platform. It employs proprietary optical technology to simultaneously measure scatter intensity at varying angles of incidence, topographic variations, surface reflectance, phase shift and photoluminescence for automatic detection and classification of a broad range of defects of interest (DOI).
Candela 8520 High Sensitivity High Throughput Wafer Inspection Tool
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Frequently Asked Questions
The Candela 8520 is used for advanced characterization of substrate and epitaxial defects for the power device market and related applications.
The implementation of automated wafer inspection with statistical process control (SPC) methodology can significantly cut yield loss due to epi defects.
The Candela 8520 is the successor to the Candela CS920 and it integrates macro/micro detection for surface and crystal defects in a unified inspection platform.
The defect map highlights each defect location on the wafer by color code.
The defect log file displays details such as location, pixel size, area, and defect type.