Candela 8720 High Sensitivity Wafer Inspectiont Tool
Description
The Candela® 8720 advanced surface inspection system captures a variety of mission-critical substrate and epitaxial defects for the LED, photonics, communications and other compound semiconductor markets. Implementation of automated wafer inspection with statistical process control (SPC) methodology can significantly cut yield loss due to epi defects, minimize metal-organic chemical vapor deposition (MOCVD) reactor process excursions, and increase MOCVD reactor uptime. The Candela 8720 system employs proprietary optical technology to simultaneously measure scatter intensity at varying degrees of incidence, topographic variations, surface reflectivity, phase shift and photoluminescence for automatic detection and classification of a broad range of defects of interest (DOI).
Candela 8720 High Sensitivity Wafer Inspectiont Tool
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Frequently Asked Questions
The Candela 8720 is used for capturing substrate and epitaxial defects in the LED, photonics, communications, and compound semiconductor markets.
The Candela 8720 system employs proprietary optical technology to measure scatter intensity, topographic variations, surface reflectivity, phase shift, and photoluminescence for automatic detection and classification of defects.
The Candela 8720 system can be operated in high-throughput mode, standard resolution mode, and high-resolution mode.
Yes, in the high-throughput mode, the Candela 8720 system can be used as a particle counter for process tool monitoring and qualification applications.
The Candela 8720 inspection output includes a defect map highlighting defect locations, a defect pareto chart showing the number of defects by type, and a defect inspection summary displaying defect statistics across the entire wafer.