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Frequently Asked Questions

The TMAP-AP metrology solution is used for 3D IC/TSV process control.

The main applications of the TMAP-AP include advanced packaging, MEMS, FOWLP, 2.5D & 3D IC, and TSV.

The TMAP-AP is able to differentiate multiple layer stacks based on the order they are placed.

Yes, the TMAP-AP's state-of-the-art design allows for dependable measurements even under highly warped conditions.

The TMAP-AP offers the best balance between performance, throughput, and cost of ownership (CoO) for 3D IC/TSV process control.

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