neoMOS-700fs: Femtosecond Laser

Key Features of the neoLASE neoMOS Femtosecond Laser

• High-power femtosecond laser performance: Delivers >50 W output power for demanding ultrafast laser processing, scientific research, and industrial micromachining applications.
• Ultrashort pulse duration: Generates pulses of <700 fs, enabling precise “cold” laser material processing with minimal heat-affected zone.
• High pulse energy: Provides >500 µJ pulse energy for efficient nonlinear optics, high-throughput microprocessing, and advanced photonics applications.
• Flexible repetition rate operation: Supports repetition rates from single shot to MHz, allowing optimization for both high-energy and high-throughput processing requirements.
• Excellent beam quality: Features TEM00 beam profile with M² < 1.3 for accurate focusing, stable beam delivery, and consistent process results.
• MOPA-based ultrafast laser architecture: Combines a reliable femtosecond oscillator with a power- and energy-scaling solid-state amplifier for stable, scalable output.
• Bandwidth-limited high-energy pulses: Designed to deliver high-quality femtosecond pulses suitable for precision laser processing and nonlinear frequency conversion.
• Compact laser head design: Small-footprint system architecture simplifies integration into laboratory setups, OEM platforms, and industrial workstations.
• Highly scalable and flexible design: Engineered for application-specific configurations, making it suitable for customized ultrafast laser solutions.
• Low-maintenance operation: Solid-state laser technology supports long-term reliability and reduced maintenance requirements compared with more complex ultrafast laser systems.
• Optimized for cold laser processing: Sub-picosecond pulse duration minimizes thermal damage, burr formation, melting, and microcracking in sensitive materials.
• Ideal for precision micromachining: Suitable for micro-drilling, micro-cutting, surface structuring, thin-film ablation, wafer processing, and high-precision material removal.
• Supports nonlinear optics applications: High peak power and excellent beam quality make the system suitable for higher harmonic generation, ultrafast spectroscopy, and advanced photonics research.
• Suitable for OPCPA pumping: High pulse energy and stable femtosecond output support use in optical parametric chirped-pulse amplification systems.
• Versatile material compatibility: Enables precise processing of metals, semiconductors, ceramics, glass, polymers, composites, and other heat-sensitive materials.
• Industrial and scientific use: Well suited for research laboratories, laser material processing centers, semiconductor manufacturing, medical device production, and OEM ultrafast laser integration.

• Cold laser micromachining: Precision femtosecond laser processing with minimal heat-affected zone for high-quality cutting, drilling, structuring, and ablation of sensitive materials.
• High-precision micro drilling: Production of micro holes, nozzles, filters, injector components, medical device features, and fine apertures in metals, ceramics, glass, polymers, and composites.
• Ultrafast laser cutting: Clean cutting of thin metals, foils, glass, sapphire, ceramics, silicon, polymers, and multilayer materials with reduced burrs, cracks, melting, and recast.
• Glass and transparent material processing: Femtosecond laser cutting, internal modification, selective ablation, scribing, dicing, and 3D structuring of glass, fused silica, quartz, and optical materials.
• Sapphire and ceramic machining: Crack-free micro processing of hard and brittle materials used in optics, electronics, sensors, LEDs, watch components, and high-performance industrial parts.
• Semiconductor wafer processing: Wafer dicing, scribing, edge trimming, micro structuring, defect repair, and thin-film patterning for silicon, compound semiconductors, MEMS, and advanced packaging.
• Microelectronics manufacturing: Precision ablation, via drilling, patterning, trimming, and structuring for PCBs, flexible circuits, interposers, sensors, displays, and miniaturized electronic components.
• Thin-film removal and patterning: Selective laser ablation of conductive, dielectric, metallic, and functional coatings for photovoltaics, displays, touch panels, microelectronics, and sensor devices.
• Photovoltaic and solar cell processing: Laser scribing, edge isolation, thin-film structuring, contact opening, and precision ablation for crystalline silicon and thin-film solar technologies.
• Medical device manufacturing: High-accuracy laser cutting and texturing of stents, catheters, implants, surgical tools, microneedles, biosensors, and diagnostic components with excellent edge quality.
• Surface texturing and functionalization: Creation of micro and nano surface structures to control friction, wettability, adhesion, biocompatibility, light absorption, anti-counterfeiting features, and tribological performance.
• Laser marking and engraving: Permanent high-resolution marking, micro engraving, serial coding, logo marking, and anti-counterfeit structuring on metals, ceramics, glass, polymers, and coated materials.
• Precision metal processing: Ultrafast ablation, drilling, cutting, and surface modification of stainless steel, titanium, aluminum, copper, precious metals, and specialty alloys with limited thermal damage.
• Polymer and composite processing: Clean micro cutting, drilling, surface activation, and patterning of polymers, films, laminates, carbon-fiber composites, and biomedical plastics.
• MEMS and sensor fabrication: Micro structuring, cavity formation, release processes, wafer-level trimming, and precision patterning for MEMS, microfluidics, pressure sensors, accelerometers, and photonic sensors.
• Microfluidics and lab-on-a-chip fabrication: Direct writing, channel formation, drilling, and surface modification in glass, polymers, fused silica, and hybrid substrates for biomedical and analytical devices.
• Optics and photonics manufacturing: Fabrication of micro optics, diffractive optical elements, waveguides, photonic structures, optical gratings, fiber components, and precision optical features.
• 3D laser micro structuring: Direct femtosecond laser writing and localized material modification for complex micro-scale geometries, internal structures, and high-aspect-ratio features.
• Nonlinear optics research: High-peak-power femtosecond pulses for nonlinear frequency conversion, supercontinuum generation, optical parametric processes, and ultrafast light-matter interaction studies.
• OPCPA pumping: High-energy femtosecond laser source for optical parametric chirped-pulse amplification systems used in ultrafast science and high-intensity laser research.
• Higher harmonic generation: Generation of UV, deep-UV, and extreme-ultraviolet radiation through nonlinear harmonic conversion for spectroscopy, microscopy, and advanced research applications.
• Ultrafast spectroscopy: Pump-probe experiments, time-resolved measurements, carrier dynamics studies, and femtosecond-scale investigation of materials, semiconductors, molecules, and nanostructures.
• Terahertz generation and detection: Femtosecond laser exc