Veshay Akemond PCB Strain Gauges TSK-1D-120-3A-11L50W05MS IPC/JEDEC 9704 PCB Strain Testing Dynamic Strain Meter

Name: Veshay Akemond PCB Strain Gauges TSK-1D-120-3A-11L50W05MS IPC/JEDEC 9704 PCB Strain Testing Dynamic Strain Meter
Brand: Dongguan Veshay Laser Technology Co., Ltd

Description

Veshay PCB Strain Gauges Measurement System

PCB Strain testing allows objective analysis of the strain and strain rate levels that a SMT package is subjected to during PWB assembly, test and operation.
The Veshay PCB Strain Measurement System is special design for printed wiring board strain testing application. The real-time data provided by the Veshay system avoid the risk such failures include solder ball cracking, trace damage, pad lifting and substrate cracking during board manufacturing and test processes.

Specifications

Device Funtion:	Strain Gauge
Measurement Range:	-55500 – 55500 uE
Accuracy:	-0.3 – 0.3 %
Stability:	6 ppm/degC
Sampling Frequency:	10 KHz (per channel)
Operational Temperature Range:	-40 – 70 degC
Resistance:	120OHMS
Sensor Size:	1.1*1.0MM
Base Size:	2.5*2.7MM
Length - Copper Wire:	50CM
Cable Wire:	50CM
Style:	Triaxial

Got questions about specs? Use the inquiry form to ask.

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Features

Veshay Stress-Strain Analysis (IPC/JEDEC 9704) - Measurement of the stress in PCBs using strain gauges

If PCBs are overstrained during production, storage or transport, they can take unnoticed mechanical damage and fail systematically later in their service life. Critical straining forces can also occur when the PCB passes through a test stand as part of the production line, for example when inserting the PCB in a test adapter. Therefore, we test the mechanical stress in the PCB throughout the test task, using strain gauges. Based on the results, we can further optimize the test adapter and minimize straining forces.

Applications

PCB industry: circuit board ICT/FCT/sub board /assembly and other stress measurement.
Other industries: vehicle, bridge, air conditioning pipeline, building strain measurement

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Frequently Asked Questions

What is the purpose of PCBA strain measurement?

The purpose of PCBA strain measurement is to monitor and control mechanical stresses to prevent failures such as cracked solder balls, circuit damage, and warped pads, which can occur during SMT, DIP, assembly, and reliability testing.

What are some common failure modes due to mechanical stress in PCBAs?

Common failure modes due to mechanical stress in PCBAs include cracked solder balls, circuit damage, warped pads, cracked substrates, capacitor Y-cracks, and 45° cracks.

Why is strain gage testing important in PCBA manufacturing?

Strain gage testing is important because it helps identify defective assembly and test processes, and provides systematic steps to perform PCBA strain testing, reducing the risk of failures and associated costs.

What is the IPC/JEDEC-9704A guideline?

The IPC/JEDEC-9704A guideline is a standard for Printed Circuit Assembly Strain Gage Testing, issued by IPC and JEDEC, which provides guidelines for identifying defective assembly and test processing.

How does the cost of addressing PCBA issues change over time?

Addressing PCBA issues costs significantly more as time progresses: $1 during the design phase, $10 during manufacturing, and $100 during production, following the 1-10-100 rule.

What industries promote the use of PCBA strain measurement standards?

Global manufacturers such as Intel, IBM, HP, and Apple promote the use of PCBA strain measurement standards, which have become part of the IPC and JEDEC guidelines.

How does strain affect solder joints in PCBs?

Solder joints are sensitive to strain, which can cause PCB stress warpage deformation leading to fracture mechanisms, especially as lead-free PCB laminate materials and interconnect density increase.

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