MicroMake 266 Plus: Laser Micromachining System

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Specifications

Materials: Metals, Thermoset Plastics, Thermoplastics, Polimers, Textile, Wood, Paper, Stones, Ceramics, Glass
Laser Type: DPSS (Other)
Laser Wavelength: 266 nm (Deep UV)
Laser Output Power: 7000 W
Laser Safety: Not classified
Work Area X: 1 mm
Work Area Y: 1 mm
Processing Speed: 50 mm/sec
Features And Options: Air-Cooled
Frequency: 10-50 kHz
Lens Magnification: 10x
Working Distance: 20 mm
Spatial Resolution: 3.0 ยตm
Overall Mechanical Dimensions: 39x24x11 cm3

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Features

  • Compact Laser Micromachining System: MicroMake by Bright System is an integrated, monolithic laser micromachining unit designed for high-precision microprocessing, microfabrication, laser ablation, microdrilling, cutting, and selective material removal.
  • High-Precision Laser Ablation and Cutting: Enables programmable machining of arbitrary shapes for controlled ablation, precision cutting, surface texturing, microstructuring, and thin-film removal.
  • Live Microscope Imaging During Processing: Built-in live imaging allows real-time sample alignment, process monitoring, and immediate quality inspection during laser machining operations.
  • Down to 2 ฮผm Laser Spot Size: Supports ultra-fine feature generation for demanding micromachining applications requiring high spatial resolution and excellent process control.
  • Standard 1 mm Processing Area: Provides a practical micromachining field for high-resolution processing of wafers, masks, displays, PCBs, ceramic substrates, optical components, and biomedical parts.
  • 532 nm and 266 nm Laser Options: Available with nanosecond and picosecond laser sources at 532 nm and 266 nm, enabling optimized processing across metals, ceramics, polymers, dielectrics, thin films, and transparent materials.
  • Suitable for a Wide Range of Materials: Designed for precise laser processing of microelectronic substrates, metal films, ceramic substrates, optical materials, transparent dielectrics, biomedical devices, and micromechanical components.
  • Direct 3D Microstructuring Capability: Supports advanced 3D direct laser microfabrication for functional microfeatures, microtextures, and high-resolution surface modifications.
  • Precision Surface Texturing: Ideal for creating controlled microtextures to modify surface properties, improve functionality, or produce engineered surface patterns.
  • PCB Track Interruption and Repair: Enables selective interruption of conductive tracks and microwires on printed circuit boards and microelectronic devices for correction, trimming, and failure analysis.
  • Microcoding for Anti-Counterfeiting: Suitable for permanent micro-marking and microcoding on small components, substrates, and devices for traceability, authentication, and anti-counterfeiting applications.
  • Thin Film Removal on Hard Substrates: Provides accurate removal of thin films from hard materials while minimizing damage to the underlying substrate.
  • Selective Metal Removal on Ceramic Substrates: Designed for high-precision removal of metal layers from ceramic substrates used in electronics, sensors, and advanced manufacturing.
  • Microcorrection of Wafers, Masks, and Displays: Supports defect correction and localized modification on wafers, photomasks, display panels, and other high-value microfabricated components.
  • Microdrilling on Metals and Transparent Dielectrics: Capable of calibrated laser microdrilling for medical devices, precision components, metals, glass-like materials, and transparent dielectric substrates.
  • Embedded Illumination Unit: Integrated illumination improves visibility, alignment accuracy, and inspection quality during micromachining operations.
  • Objective Lens Flexibility: Supplied with a standard 10X objective lens, with additional objective lenses available to adapt the system for different spot sizes, fields of view, and processing requirements.
  • High-Speed USB Camera Option: Optional high-speed, high-resolution USB camera enables enhanced live monitoring, alignment, documentation, and process verification.
  • Optional XYZ Translation Stage: Available with manual or motorized XY and Z stages for precise sample positioning and expanded processing flexibility.
  • Typical 120 mm XY Travel: Optional XY manual or motorized stage provides large-area positioning capability for samples, devices, and substrates.
  • Typical 40 mm Z Travel: Optional Z manual or motorized stage supports accurate focus adjustment and processing of components with varying thicknesses.
  • OEM-Ready Compact Design: The compact footprint and single low-voltage power requirement make MicroMake well suited for OEM integration into automated production, inspection, and repair systems.
  • Ready-to-Use Workstation Configuration: Available as a table-top laser micromachining workstation with external mounts, manual stages, AC power supply unit, and optional safety enclosure.
  • Class 1 Safety Enclosure Option: Optional Class 1 laser safe

Applications

  • Laser micromachining and microfabrication: high-precision machining of miniature components, complex microfeatures, and programmable arbitrary shapes with micron-level accuracy.
  • 3D direct microstructuring: fabrication of three-dimensional microstructures, functional surface profiles, cavities, channels, and patterned features on a wide range of materials.
  • Precision laser ablation: controlled material removal for research, prototyping, product development, and small-scale production applications.
  • Laser microcutting: fine cutting of thin foils, films, metals, ceramics, polymers, glass, and other technical materials requiring narrow kerf widths and high edge quality.
  • Laser microdrilling: calibrated drilling of microholes in metals, transparent dielectrics, medical devices, sensors, microfluidic components, and precision mechanical parts.
  • Surface texturing and functionalization: creation of precision microtextures for improved adhesion, wettability control, friction reduction, tribology studies, optical effects, and biomedical surface modification.
  • PCB track interruption and circuit repair: selective cutting, trimming, and interruption of conductive tracks on printed circuit boards, flexible circuits, and microelectronic assemblies.
  • Selective metal removal: localized removal of metal layers from ceramic substrates, glass substrates, wafers, masks, and electronic devices without excessive damage to the underlying material.
  • Thin film patterning and removal: precise structuring or stripping of thin films on hard substrates, including coated glass, ceramics, semiconductors, and display-related materials.
  • Microcorrection of wafers, masks, and displays: repair and correction of defects on semiconductor wafers, photomasks, metal masks, display panels, and microelectronic components.
  • Metal mask defect correction: localized ablation and repair of metal mask defects for microelectronics, displays, and precision patterning applications.
  • Microwire interruption: selective interruption of fine wires, conductive paths, and microconnections for electronics testing, sensor development, and device trimming.
  • Anti-counterfeiting microcoding: laser marking, micro-engraving, and coding of security features, identification marks, serial numbers, QR-style microcodes, and traceability patterns.
  • Biomedical device micromachining: precision drilling, cutting, texturing, and marking of medical components, implants, surgical tools, diagnostic devices, and microfluidic biomedical structures.
  • Microfluidics fabrication: creation of microchannels, ports, reservoirs, and access holes in glass, polymers, ceramics, and transparent dielectric materials.
  • Optical substrate processing: micromachining of optical glass, coated optics, transparent dielectrics, and functional optical surfaces for photonics and optoelectronics applications.
  • Semiconductor and MEMS processing: localized laser trimming, patterning, ablation, wafer correction, mask repair, and microfeature generation for semiconductor devices and MEMS components.
  • Display manufacturing and repair: microcorrection, thin film removal, conductive layer patterning, and defect repair for flat-panel displays and related display technologies.
  • Sensor and microsystem fabrication: precise structuring, drilling, trimming, and marking of sensor substrates, microelectrodes, ceramic packages, and miniaturized device components.
  • Micromechanics and precision manufacturing: production of fine mechanical features, slots, holes, grooves, and miniature parts for watches, instruments, aerospace components, and high-value engineering devices.
  • R&D laser processing workstation: ideal for laboratories, universities, research centers, and development teams requiring flexible laser ablation, cutting, drilling, and imaging in a compact system.
  • OEM integration for laser microprocessing: compact laser micromachining module suitable for integration into custom production platforms, automated inspection systems, and specialized manufacturing tools.