Description
The MicroMake Laser Micromachining System from Bright System is a cutting-edge solution for high-precision laser microprocessing tasks. This compact and integrated unit offers live imaging of processed samples during machining, enabling real-time quality assessment.
With the ability to ablate and cut programmable arbitrary shapes, it caters to a diverse range of applications such as precision surface texturing, microdrilling, and selective material removal. Equipped with both 532 nm and 266 nm lasers, it ensures versatility across various materials, from microelectronic circuits to biomedical devices and optical substrates. Featuring a standard 1 mm processing area and a spot size as small as 2 µm, it provides exceptional precision and resolution.
Optional features like different objective lenses, a high-speed USB camera, and an XYZ translation stage further enhance its capabilities. Compact in design and requiring low-voltage electrical power, the MicroMake system is ideal for OEM customers, while additional options can transform it into a comprehensive laser micromachining workstation, ready for a wide array of microfabrication tasks.
MicroMake 266 Laser Micromachining System
Specifications
Materials: | Metals, Thermoset Plastics, Thermoplastics, Polimers, Textile, Wood, Paper, Stones, Ceramics, Glass |
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Laser Type: | DPSS (Other) |
Laser Wavelength: | 266 nm (Deep UV) |
Laser Output Power: | 700 W |
Laser Safety: | Not classified |
Work Area X: | 1 mm |
Work Area Y: | 1 mm |
Processing Speed: | 2 mm/sec |
Features And Options: | Air-Cooled |
Lens Magnification: | 10x |
Working Distance: | 20 mm |
Spatial Resolution: | 2.5 µm |
Frequency: | 1 kHz |
Overall Mechanical Dimensions: | 39x20x11 cm3 |
Weight: | 10 kg |
Features
- Ablation and cutting of programmable arbitrary shapes
- Live imaging of processed samples during machining
- Suitable for a wide range of materials
- Down to 2 µm spot size
- 532/266 nm ns and ps lasers
- Embedded illumination unit
- Optional XYZ translation stage
Applications
- 3D direct microstructuring
- Precision surface texturing
- Track interruption on PCBs
- Microcoding for anti-counterfeiting
- Thin film removal on hard substrates
- Selective metal removal on ceramic substrates
- Microcorrection on wafers, masks, and displays
- Microdrilling on metals and transparent dielectrics
Frequently Asked Questions
What is the MicroMake Laser Micromachining System?
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