J Series High Power Multiwavelength Laser Micromachining System

Specifications

Materials: Metals
Laser Type: DPSS (Other)
Laser Wavelength: 325 nm (UV), 351 nm (UV), 355 nm (UV), 527 nm (green), 532 nm (green), 800 nm (near IR), 810 nm (near IR), 1054 nm (IR), 1064 nm (IR), 1070 nm (IR), 10.6 um (IR)
Laser Output Power: Not Specified
Laser Safety: Class 1
Work Area X: 150 mm
Work Area Y: 150 mm
Processing Speed: Not Specified
Features And Options: Includes Safety Enclosure, Multiple Wavelength, Other (see Data Sheet)
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Features

  • Turn-key
  • Class 1 laser safe
  • Granite Construction
  • Vibration Isolated
  • Solid state laser
  • Single screen software control
  • Advanced CNC controller
  • Linear motor, linear encoder XY stages
  • 150x150mm travel XY
  • Motorised Z axis 50mm travel
  • On-axis vision system with cross hair
  • Motorized optical attenuator

Applications

J Series High Power Multiwavelength Laser Micro-Matching System can be used for the following applications:
  • Materials Processing
  • Thin Film Scribing
  • Microelectronics
  • Optoelectronics