Description
The **AOPico™ Series** of industrial picosecond lasers by Advanced Optowave™ represents a cutting-edge solution in diode-pumped solid-state laser technology. These lasers are meticulously engineered to deliver unparalleled performance in various high-precision applications.
The PICO-IR-1064/GR-532/UV-355 models are specifically designed to meet the demanding needs of industries such as thin-film ablation, medical device manufacturing, polymer processing, semiconductor processing, and high-speed micro-machining. At the heart of the AOPico™ Series is a commitment to excellence and innovation. These lasers offer superior beam quality with an M² value of less than 1.3, ensuring precise and consistent results. Available in infrared, green, and ultraviolet wavelengths, the series provides flexibility for diverse applications.
With pulse durations of just 7 picoseconds, these lasers enable high-speed and high-precision operations, making them ideal for tasks that require meticulous attention to detail. The AOPico™ Series stands out in the industry for its reliability and cost-effectiveness. Designed with a focus on minimizing ownership costs, these lasers feature a burst mode option and robust construction that ensures durability and long-term performance. Advanced Optowave™ is dedicated to continuous product improvement, ensuring that each laser in the series remains at the forefront of technological advancement.
Compliance with CDRH, ROHS, and CE standards further underscores the commitment to quality and safety, making the AOPico™ Series a trusted choice for professionals worldwide.
AOPico 532 20-1000 Industrial Picosecond Lasers for Precision Micro-machining
Specifications
| Avg. Power: | 20 W |
|---|---|
| Wavelength: | 532 nm |
| Repetition Rate: | 20 – 1000 kHz |
| Spatial Mode (M^2): | 1.3 |
| Pulse Duration: | 0.007 ns |
| Pulse-to-Pulse Stability (RMS): | 2 % |
| Cooling: | Water-to-Water |
| Energy (µJ): | 100 |
| Repetition Rate (kHz): | Single Shot to 1000 |
| Beam Roundness (%): | >85 |
| Beam Diameter (mm): | ~1.0 |
| Beam Divergence (mRad): | <1.3 |
| Point Stability (µrad/ºC): | <50 |
| Polarization Ratio: | 100:1 Linear, Horizontal |
| Polarization Ratio: | 100:1 Linear, Vertical |
| Polarization Ratio: | 100:1 Linear, Horizontal |
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Features
- Versatile Wavelength Options: Available in IR (1064 nm), Green (532 nm), and UV (355 nm) for diverse industrial applications.
- High Average Power: Offers up to 45W average power for efficient processing.
- Ultra-Short Pulse Duration: Delivers pulse durations of 7 picoseconds for precision micro-machining.
- Excellent Beam Quality: Beam quality of M2 <1.3 ensures high-precision results.
- Cost-Effective Operation: Features the lowest cost of ownership in the industry.
- Reliable Design: Highly reliable design with burst mode option for enhanced performance.
- Advanced Applications: Ideal for thin-film ablation, medical device manufacturing, polymer processing, semiconductor and PV processing, wafer scribing, high-speed micro-machining, and brittle material cutting.
- Stable Performance: Pulse-to-pulse stability of <2% RMS and average power stability of <3% over 12 hours.
- Wide Operational Range: Operates efficiently within a temperature range of 15 to 30ºC and humidity range of 20 to 80% non-condensing.
- Easy Integration: RS-232 communication for seamless integration with existing systems.
- Efficient Cooling: Water cooling system ensures optimal performance and longevity.
- Compliance and Safety: Meets CDRH, ROHS, and CE compliance standards for safe operation.
Applications
- Thin-Film Ablation
- Medical Device Manufacturing
- Polymer Processing/Machining
- Semiconductor/PV Processing/Wafer Scribing
- High-Precision, High-Speed Micro-machining
- Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking
Frequently Asked Questions
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