AONano 532-30W-50K ND:YV04 GR Laser

Specifications

Avg. Power: 30 W
Wavelength: 532 nm
Repetition Rate: 1 – 300 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 20 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Air
Average Power: 5W, 10W, 15W
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <10ns @20kHz, <30ns @100kHz
Pulse Energy (mJ @ 1kHz): >150uJ, >300uJ
Polarization Ratio: >100:1 LINEAR, VERTICAL
Operating Voltage (VAC): 90-260
Line Frequency (Hz): 47-63
Operation Temperature: 15º - 30º C
Storage Temperature: -20º - 50º C
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Features

  • Innovative End-Pumping Technology: Experience enhanced performance with advanced end-pumping technology.
  • Air-Cooling System: Efficient air-cooling supports average power up to 10W, ensuring optimal performance.
  • Excellent Beam Quality: Achieve superior beam quality, pulse stability, and point stability for precision applications.
  • Patent Pending Harmonic Conversion Technologies: Benefit from cutting-edge harmonic conversion technologies for improved efficiency.
  • Ultra-Compact & Light-Weight Design: Easy to handle and integrate into various systems due to its compact and lightweight design.
  • Brand-New Focusing Optics: Enhanced focusing optics for precise laser applications.
  • Field-Replaceable Diode: Simplifies maintenance with easy field-replacement of fiber-coupled pumping diodes.
  • 24/7 Proven Reliability: Engineered for continuous operation in demanding production environments.
  • Low Operational Cost: Designed to minimize operational expenses while maximizing productivity.
  • Q-Switched TEM00 Mode Lasers: Optimized for high-performance with pulse frequencies ranging from 1-300 kHz (optional up to 1 MHz).
  • Flexible Laser Architectures: Customizable laser solutions to meet specific application requirements.
  • Sealed Laser Head: Ensures long-term reliability with a clean room sealed laser head.

Applications

  • Precision Micromachining: Ideal for high-accuracy material processing.
  • Electronics Marking: Suitable for fine marking of semiconductor and PCB components.
  • Medical Device Manufacturing: Supports precision cutting and drilling tasks.
  • Solar Cell Scribing: Enables efficient and accurate scribing processes.
  • Scientific Research: Provides stable, high-quality output for advanced experiments.