AOFemto 1030nm 20W DPSS Laser

Specifications

Avg. Power: 20 W
Wavelength: 1030 nm
Repetition Rate: 1 – 200 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.0008 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Energy: 20 µJ
Repetition Rate: Single Shot to 1000 kHz
Beam Roundness: >85 %
Beam Diameter: 2.0 mm
Beam Divergence: <1.3 mRad
Beam Divergence: <0.7 mRad
Point Stability: <20 µrad/ºC
Polarization Ratio: 100:1 Linear, Vertical
Polarization Ratio: 100:1 Linear, Horizontal
Pulse-to-Pulse Stability: <2 % RMS
Operational Temperature Range: 15 to 30 ºC
Storage Temperature Range: -20 to 50 ºC
Input Voltage: 90 to 260 VAC
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Features

  • Lowest Cost of Ownership: Designed to offer the most cost-effective solution in the industry.
  • Excellent Beam Quality: Achieve superior results with an M2 value of less than 1.3.
  • Versatile Wavelength Options: Available in IR, Green, and UV for diverse applications.
  • High Average Power: Capable of delivering up to 15W average power for demanding tasks.
  • Ultra-Short Pulse Durations: Features pulse durations of less than 800 femtoseconds for precision work.
  • Reliable Design: Engineered for high reliability to ensure consistent performance.
  • Burst Mode Option: Includes a burst mode for enhanced flexibility in operations.
  • Wide Application Range: Suitable for injector drilling, medical device manufacturing, polymer processing, semiconductor processing, and high-precision micro-machining.
  • Advanced Material Processing: Ideal for brittle material cutting, drilling, dicing, and sub-surface marking.
  • Compliance: Meets CDRH, ROHS, and CE standards for safety and quality assurance.
  • Operational Efficiency: Quick cold start warm-up time of less than 30 minutes and standby warm-up time of less than 20 minutes.
  • Environmental Conditions: Operates efficiently within a temperature range of 15 to 30°C and humidity range of 20 to 80% non-condensing.
  • Flexible Communication: Equipped with RS-232 communication for easy integration.
  • Efficient Cooling: Utilizes water cooling to maintain optimal performance.

Applications

  • Injector Drilling
  • Medical Device Manufacturing
  • Polymer Processing/Machining
  • Semiconductor/PV Processing/Wafer Scribing
  • High-Precision, High-Speed Micro-machining
  • Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking