Aluminum Nitride Substrate
Description
Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads are made of ceramic materials such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Power Devices, Integrated Circuit (IC) chip packaging heat conduction, MOSFET Transistor, IGBT Transistor Heat Sink, MOS Transistor, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.
Aluminum Nitride Substrate
Specifications |
|
|---|---|
| Material: | Aluminum Nitride |
| Type Of Ceramic: | Unglazed |
| Component Type: | Substrates |
| Thermal Conductivity: | 170-220 W / (m * K) |
| Density: | ≥ 3.3 g/cm3 |
| Open Porosity: | 0 vol.-% |
| Bending Strength σ M: | ≥ 350 MPa |
| Young's Modulus: | ≥ 320 GPa |
| Specific Heat: | 740 J / (kg * K) |
| Typical Colour: | Grey - |
Features
High thermal conductivity
Excellent thermal shock resistance
Excellent insulation, >15KV / cm
Plasma etching resistance
Good shock resistance
Non-toxic
Excellent mechanical properties
Applications
IC packaging
Components for semiconductor equipment
Thermal module substrate
High power transistor module substrate
High frequency device substrate
Exothermic insulation board for Thyristor Modules
Semiconductor laser, fixed substrate for light emitting diode (LED)
Hybrid integrated module, ignition device module
For pricing, technical or any other questions please contact the supplier
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How to order?
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Ships from:
China
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Sold by:
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On FindLight:
since 2020