Frequently Asked Questions

Innovacera Ceramic Thermally Conductive Interface Pads are used to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices.

The pads are made of ceramic materials such as alumina ceramic and aluminum nitride.

The pads have high thermal conductivity, excellent thermal shock resistance, excellent insulation (>15KV/cm), plasma etching resistance, good shock resistance, non-toxicity, and excellent mechanical properties.

Some typical applications include IC chip packaging heat conduction, MOSFET Transistor, IGBT Transistor Heat Sink, LED board Thermal Interface Material (TIM), and semiconductor laser substrate.

Aluminum nitride has a density of 3.33 g/cm3, thermal conductivity of 210 W/m.K, bending strength of 300 Mpa, insulation of 27 KV/mm, dielectric constant of 8.9, and a thermal expansion coefficient of 4.9 (10-6).

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