Aluminum Nitride Substrate
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Ships from:
China
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Sold by:
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On FindLight:
since 2020
Description
Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads are made of ceramic materials such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Power Devices, Integrated Circuit (IC) chip packaging heat conduction, MOSFET Transistor, IGBT Transistor Heat Sink, MOS Transistor, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.
Aluminum Nitride Substrate
Specifications |
|
|---|---|
| Material: | Aluminum Nitride |
| Type Of Ceramic: | Unglazed |
| Component Type: | Substrates |
| Thermal Conductivity: | 170-220 W / (m * K) |
| Density: | ≥ 3.3 g/cm3 |
| Open Porosity: | 0 vol.-% |
| Bending Strength σ M: | ≥ 350 MPa |
| Young's Modulus: | ≥ 320 GPa |
| Specific Heat: | 740 J / (kg * K) |
| Typical Colour: | Grey - |
Features
High thermal conductivity
Excellent thermal shock resistance
Excellent insulation, >15KV / cm
Plasma etching resistance
Good shock resistance
Non-toxic
Excellent mechanical properties
Applications
IC packaging
Components for semiconductor equipment
Thermal module substrate
High power transistor module substrate
High frequency device substrate
Exothermic insulation board for Thyristor Modules
Semiconductor laser, fixed substrate for light emitting diode (LED)
Hybrid integrated module, ignition device module
Frequently Asked Questions
Innovacera Ceramic Thermally Conductive Interface Pads are used to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices.
The pads are made of ceramic materials such as alumina ceramic and aluminum nitride.
The pads have high thermal conductivity, excellent thermal shock resistance, excellent insulation (>15KV/cm), plasma etching resistance, good shock resistance, non-toxicity, and excellent mechanical properties.
Some typical applications include IC chip packaging heat conduction, MOSFET Transistor, IGBT Transistor Heat Sink, LED board Thermal Interface Material (TIM), and semiconductor laser substrate.
Aluminum nitride has a density of 3.33 g/cm3, thermal conductivity of 210 W/m.K, bending strength of 300 Mpa, insulation of 27 KV/mm, dielectric constant of 8.9, and a thermal expansion coefficient of 4.9 (10-6).