Aluminum Nitride Substrates and Components

Specifications

Material: Aluminum Nitride
Type Of Ceramic: Not Applicable
Component Type: Substrates
Standard Thickness: 0.025 inches
Standard Thickness: 0.040 inches
Tape Casting Size: 5 inches by 7 inches
Tape Casting Thickness: 0.060 inches
Dry Pressing Size: 2 inches square
Dry Pressing Thickness: 0.250 inches
Standard Thermal Conductivity: 170 W/m°K
Specialized Thermal Conductivity: 200 W/m°K
Isostatically Pressed Component Cross Section: 2 inches
Isostatically Pressed Component Length: 8 inches
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Features


  • High Thermal Conductivity: Standard substrates provide at least 170 W/m°K thermal conductivity, with specialized methods achieving up to 200 W/m°K.

  • Low Thermal Expansion: Ensures stability and reliability in various applications.

  • Dielectric Properties: Suitable for applications requiring electrical insulation.

  • Cost-Effective: Offers a balance of performance and affordability.

  • Fast Delivery: Inventory of standard sizes ensures quick fulfillment of orders.

  • Variety of Sizes: Tape casting produces substrates up to 5 inches by 7 inches and .060 inches thick, while dry pressing allows for sizes up to 2 inches square and .250 inches thick.

  • Versatile Processing Compatibility: Ready for mechanical dicing, laser scribing, cutting, and various metallizing processes.

  • Custom Components: Isostatically pressed aluminum nitride components available in bars, rods, and tiles with up to 2-inch cross section and 8-inch length, precision-machined to specifications.

Applications


  • Power Electronics: Ideal for substrates in high-power circuits requiring efficient heat dissipation.

  • LED Packaging: Provides thermal management and electrical insulation for high-brightness LEDs.

  • RF and Microwave Devices: Supports high-frequency components with stable thermal properties.

  • Optoelectronic Modules: Suitable for laser diode and photonic device mounting.

  • Thick and Thin Film Circuits: Compatible with hybrid circuit metallization processes.

  • Direct Bond Copper Applications: Enables direct copper bonding for advanced packaging solutions.