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Frequently Asked Questions

The ProVia FP-C Laser Microvia Drilling System can be used for blind and through-hole via drilling, cutting, routing, circuit excising, skiving/cavity formation, and defect repair.

The ProVia FP-C Laser Microvia Drilling System features an intuitive graphical user interface with ProSys operating software, advanced beam positioning and laser pulse control, auto-calibration functions, continuously variable CO2 spot size using the programmable zoom telescope, extensive system diagnostics, sealed beam delivery, APSTM (Active Pulse Shaping), touchscreen operation, and automatic run-time calibration.

The ProSys software is an advanced control software that allows for automated drill file conversion and job generation, provides a vision display of the job features and process status, and allows precise control over bite size, spiral.

The ProVia FP-C Laser Microvia Drilling System is an advanced processing workstation for rigid boards, with high performance beam positioning for rapid point-to-point drilling and routing complex features.

The ProVia models are available in UV-only, CO2-only, or hybrid version with both laser sources.

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