microSTRUCT C Highly Versatile Laser Micromachining System
Description
microSTRUCT C Highly Versatile Laser Micromachining System
Specifications |
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|---|---|
| Materials: | Metals, Thermoset Plastics, Thermoplastics, Polimers, Textile, Wood, Paper, Stones, Ceramics, Glass |
| Laser Type: | DPSS (Other), Ultrafast |
| Laser Wavelength: | 355 nm (UV), 532 nm (green), 1064 nm (IR) |
| Laser Output Power: | -- W |
| Laser Safety: | Class 1 |
| Work Area X: | 275 mm |
| Work Area Y: | 250 mm |
| Processing Speed: | -- mm/sec |
| Features And Options: | Integrated, Multi-Axis, Multiple Wavelength |
| Additional Wavelengths: | 532nm, 355nm |
Features
- Flexible, stable and repeatable machining results
- Two independent and free configurable working areas with various optical setups
- Open system concept for the integration of different laser sources
- High range of software functions (Masterscript)
- User-friendly, flexible, upgradeable system
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Germany
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The different configuration packages available for the microSTRUCT C laser micromachining system include Basic (one working area, prepared for one laser source with one wavelength, upgrade ready), Advanced (two working areas, prepared for one laser source with up to three wavelengths), and Superior (two working areas, prepared for two laser sources with up to three wavelengths, incl. high accuracy vision system, scanner upgrade, and preinstalled process gas package).
The microSTRUCT C laser micromachining system offers flexible, stable, and repeatable machining results, two independent and free configurable working areas with various optical setups, an open system concept for the integration of different laser sources, a high range of software functions (Masterscript), and a user-friendly, flexible, upgradeable system.
The microSTRUCT C laser micromachining system is predominantly used in product development and applied research for laser structuring, cutting, drilling, and welding applications on a variety of substrates.
The microSTRUCT C laser micromachining system has a laser class 1 housing with an integrated control panel, a certified laser window or overview camera (webcam), and an active exhaust system included for safety.
The microSTRUCT C laser micromachining system can work on a variety of substrates, including metals, alloys, transparent and biological material, ceramics, and thin film compound systems.