ML301EXWH Laser Dicing Machine
Description
ML301EXWH Laser Dicing Machine
Specifications |
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|---|---|
| Wafer Size: | 200 mm (~8 in), 300 mm (~12 in) |
| Spindle Rotation Speed: | -- rpm |
| X-Axis Stroke (Cutting Range): | 550 mm |
| X-Axis Speed: | -- mm/s |
| X-Axis Resolution: | 2 um |
| Y-Axis Stroke (Cutting Range): | 427 mm |
| Y-Axis Speed: | -- mm/sec |
| Y-Axis Resolution: | 0.2 um |
| Z-Axis Stroke: | 8.5 mm |
| Z-Axis Speed: | -- mm/sec |
| Z-Axis Resolution: | 0.01 um |
| Materials: | Silicon, Other |
| Weight: | 2500 kg |
| Electrical Requirements: | 220V - 50Hz, 240V - 50Hz, 380V - 50Hz |
| Max Power Consumption: | ~ 7 kVA |
| Laser Safety: | Class 1 |
Applications
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Ships from:
Japan
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Frequently Asked Questions
The ML301EXWH Laser Dicing Machine is used for stealth dicing of 8 in and 12 in silicon wafers.
The key features of the ML301EXWH Laser Dicing Machine include a 12-inch size, a wafer handling system, a visible light microscope, ease of operation, accuracy, and high throughput.
Yes, the ML301EXWH Laser Dicing Machine is capable of handling both 8 in and 12 in silicon wafers.
Yes, the ML301EXWH Laser Dicing Machine comes with a wafer handling system, making it a fully integrated system.
The ML301EXWH Laser Dicing Machine offers ease of operation, high accuracy, and high throughput, making it an efficient and reliable choice for laser dicing applications.