DFL7362 Fully Automatic Laser Saw
Description
DFL7362 Fully Automatic Laser Saw
Specifications |
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|---|---|
| Wafer Size: | 300 mm (~12 in) |
| Spindle Rotation Speed: | 2000 rpm |
| X-Axis Stroke (Cutting Range): | 310 mm |
| X-Axis Speed: | 2000 mm/s |
| X-Axis Resolution: | 0.1 um |
| Y-Axis Stroke (Cutting Range): | 300 mm |
| Y-Axis Speed: | 2000 mm/sec |
| Y-Axis Resolution: | 1 um |
| Z-Axis Stroke: | 300 mm |
| Z-Axis Speed: | 2000 mm/sec |
| Z-Axis Resolution: | 1 um |
| Materials: | Silicon |
| Weight: | 2850 kg |
| Electrical Requirements: | Other / Not Specified |
| Max Power Consumption: | Not Specified |
| Laser Safety: | Class 1 |
Features
- DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
- Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
- The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
Japan
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The DFL7362 laser saw is mainly used to singulate ultra-thin Si wafers with a thickness of 50 µm or less.
The DFL7362 laser saw offers high-speed, high-quality processing of ultra-thin Si wafers. It has both wafer and frame transferring capabilities and supports a wide range of applications.
The DFL7362 laser saw can handle workpieces with a maximum size of Φ300 mm.
The DFL7362 laser saw improves throughput by approximately 30% through increased maximum X-axis speed and acceleration, as well as reduced wafer transfer and alignment times.
The DFL7362 laser saw is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.