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Frequently Asked Questions

microDICE significantly reduces the dicing cost per wafer compared to traditional separation technologies.

The available options for microDICE include automated wafer handling, second unit for scribing, SECS/GEM interface, filter fan unit, and drying unit.

The maximum dicing speed of microDICE is up to 300 mm/s.

The microDICE Enabling TLS-DicingTM System is a high-performance laser dicing system that separates wafers into dies using TLS-DicingTM technology.

microDICE can handle up to 300 mm (12“) wafer size.

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