Silicon Wafer Laser Dicing and Scribing Machine
Description
cost effective and simple way to dice and scribe wafers with high accuracy and long term
reliability.
Silicon Wafer Laser Dicing and Scribing Machine
Specifications |
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|---|---|
| Wafer Size: | 450 mm (17.7 in), 675 mm (26.6 in) |
| Spindle Rotation Speed: | -- rpm |
| X-Axis Stroke (Cutting Range): | 650 mm |
| X-Axis Speed: | 800 mm/s |
| X-Axis Resolution: | -- um |
| Y-Axis Stroke (Cutting Range): | 450 mm |
| Y-Axis Speed: | 800 mm/sec |
| Y-Axis Resolution: | -- um |
| Z-Axis Stroke: | -- mm |
| Z-Axis Speed: | -- mm/sec |
| Z-Axis Resolution: | -- um |
| Materials: | Silicon, Polymers, Glass |
| Weight: | -- kg |
| Electrical Requirements: | 220V - 50Hz, 380V - 50Hz |
| Max Power Consumption: | ~ 5 kVA |
Applications
- Mobile phone cover plate and optical lens contour cutting
- Fingerprint identification chip cutting
- New flexible display or fine electronic circuit etching & cutting for organic & inorganic materials
- Liquid crystal panel cutting
- Sapphire and glass cover plates
- Optical glass
- Semiconductor packaging chip
- Ceramic substrates
- Heat-sensitive polymers
- Inorganic materials
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The Silicon Wafer Laser Dicing and Scribing Machine is used for dicing and scribing wafers with high accuracy and long term reliability.
The machine can be used on copper laminate wafers with multi-layers of different materials, sapphire and glass cover plates, optical glass, semiconductor packaging chips, ceramic substrates, heat-sensitive polymers, and inorganic materials.
Using lasers for dicing and scribing offers a high throughput, cost-effective, and simple way to achieve accuracy and long-term reliability.
In the past, charring and long cycle time were known issues in laser cutting. However, with the advent of new types of lasers and Beyond Laser technological expertise, these problems have been solved.
Scribing a silicon wafer involves creating partial cut lines on the wafer, which introduces regions of weakness. This is usually followed by a mechanical breaking procedure to produce silicon rectangular tiles for subsequent operations.