DFL7341 Fully Automatic Laser Saw
Description
DFL7341 Fully Automatic Laser Saw
Specifications |
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|---|---|
| Wafer Size: | 200 mm (~8 in) |
| Spindle Rotation Speed: | 1000 rpm |
| X-Axis Stroke (Cutting Range): | 210 mm |
| X-Axis Speed: | 1000 mm/s |
| X-Axis Resolution: | 0.1 um |
| Y-Axis Stroke (Cutting Range): | 210 mm |
| Y-Axis Speed: | 1000 mm/sec |
| Y-Axis Resolution: | 0.1 um |
| Z-Axis Stroke: | 210 mm |
| Z-Axis Speed: | 1000 mm/sec |
| Z-Axis Resolution: | 0.1 um |
| Materials: | Silicon, Polymers, Other |
| Weight: | 1800 kg |
| Electrical Requirements: | Other / Not Specified |
| Max Power Consumption: | Not Specified |
| Laser Safety: | Class 1 |
Features
- Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
- This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.
Applications
For pricing, technical or any other questions please contact the supplier
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- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
Japan
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Sold by:
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On FindLight:
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Frequently Asked Questions
The DFL7341 laser saw can process sapphire, lithium tantalate, SiC, GaAs, and MEMS.
The Stealth Dicing™ process is a method that allows for singulating brittle materials without chipping. It is a completely dry process, making it suitable for processing devices susceptible to water damage.
Yes, the DFL7341 laser saw has a height adjustment function that allows it to perform the Stealth Dicing™ process based on the wafer surface height, making it possible to reliably process wafers with significant warpage.
The DFL7341 laser saw can handle workpieces with a maximum size of Φ200 mm.
The DFL7341 laser saw has a positioning accuracy of 0.003/210 mm (single error) for the X-axis and 0.002/5 mm for the Y-axis.