Specifications

Type Of Service: Engineering design
Minimum Laser Via Diameter: 30um
Laser Routing Tolerances: 25um or better
Infrared (CO2) Positional And Dimensional Tolerances: +/-.002” (50um)
Ultraviolet (UV) Positional And Dimensional Tolerances: +/-.001” (25um)
Serialization Tolerance: Up to 10um
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Features


  • Comprehensive PCB Laser Services: From single-sided to multi-layer, rigid and flexible circuits, MLT offers a cost-effective, outsourced solution for circuit board manufacturers.

  • Microvia Drilling: Provides laser drilling for copper clad and unclad laminates to IPC high density interconnect standards, with laser vias as small as 30um in diameter.

  • Laser Routing: Achieve 25um or better tolerances with minimal visual discoloration, radius-free internal edge profiles, and no mechanical stresses. Ideal for applications like excising, depaneling, and thermal management preforms.

  • Laser Skiving: Allows for controlled material removal to a limited depth or targeted layer, suitable for cavity formation, floating contacts, and selective soldermask removal.

  • PCB Laser Rework: Precision laser rework services to minimize scrap and ensure timely deliveries, including solder mask removal and BGA decapsulation.

  • Laser Marking, Barcodes, and Serialization: High-resolution, non-contact markings compliant with MIL-STD-130M and SEMI M12/M13 standards.

  • Laser Service Advantages: Offers positional and dimensional tolerances with infrared (CO2) at +/-.002” (50um) and ultraviolet (UV) at +/-.001” (25um).

  • Diverse PCB Materials: Compatible with a wide range of materials including FR4, Isola, Rogers, Duroid, Teflon, and more.

  • Advanced Technology: MLT's advanced laser material processing provides a competitive edge and enhances product technology.

  • Industry Standards: AS9100 Certified and ITAR Registered, ensuring high-quality and compliant services.

Applications


  • HDI PCB Manufacturing: Supports blind, buried, stacked, and through-via configurations.

  • Depaneling & Routing: Ideal for excising circuits, scoring, or connector profiling without mechanical stress.

  • Cavity & Isolation Features: Enables cavity formation, floating contacts, and buried pad exposure.

  • PCB Rework & Repair: Minimizes scrap by reworking soldermask, gold shorts, or BGA decapsulation.

  • Product Identification: Delivers compliant marking, serialization, and traceability for electronics and defense industries.