Specifications

Type Of Service: Engineering design
Minimum Laser Via Diameter: 30 um
Laser Routing Tolerances: 25 um or better
Infrared (CO2) Tolerances: +/- .002” (50 um)
Ultraviolet (UV) Tolerances: +/- .001” (25 um)
Serialization Tolerance: Up to 10 um
Document icon Download Data Sheet Download icon

Features


  • Microvia Drilling: Produces vias down to 30 µm with IPC HDI compliance.

  • High-Precision Routing: ±25 µm tolerances, radius-free edges, and no mechanical stresses.

  • Laser Skiving: Controlled material removal for cavity formation and selective layer access.

  • Laser Rework: Restores non-conforming boards, reducing scrap and improving yields.

  • Laser Marking: Permanent barcodes, serialization, and logos compliant with defense and semiconductor standards.

  • Versatile Material Compatibility: Processes FR4, polyimide, PTFE, ceramics, and advanced composites.

  • Certified Quality: AS9100C and ISO9001 certified, ITAR registered, ensuring aerospace-grade compliance.

  • Fast Turnaround: Same-day services available for production overflow.

Applications


  • HDI PCB Fabrication: Microvia drilling and stacked via formation for advanced interconnects.

  • Depaneling and Routing: Precision excising of boards, connectors, and scoring operations.

  • Cavity Formation & Isolation: Controlled skiving for buried pads, floating contacts, and soldermask removal.

  • PCB Rework & Recovery: Salvaging non-conforming products through selective material removal.

  • Component & Product Marking: Permanent barcodes, serialization, and logos for traceability.

  • Aerospace and Defense Electronics: ITAR-compliant processing for mission-critical applications.