Laser Marking
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Ships from:
United States
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Sold by:
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On FindLight:
since 2020
Description
Micron Laser Technology (MLT) stands at the forefront of laser services for the printed circuit board industry, offering a comprehensive range of solutions that cater to both single-sided and multi-layer, rigid and flexible circuits. As a trusted partner in manufacturing, MLT provides advanced laser material processing that enhances product technology and delivers a competitive edge to circuit board manufacturers. By outsourcing to MLT, companies can achieve cost-effective solutions that meet the high standards of modern electronics production.
MLT's expertise in microvia laser drilling is a testament to their commitment to precision and quality. The company offers microvia drilling processes for both copper clad and unclad laminates, adhering to IPC high-density interconnect standards. With the capability to produce laser vias with a minimum diameter of 30 micrometers, MLT ensures that even the most intricate designs are executed with accuracy and reliability.
In addition to drilling, MLT excels in PCB laser routing services, providing cutting-edge solutions that boast tolerances of 25 micrometers or better. This service minimizes visual discoloration and eliminates mechanical stresses, offering radius-free internal edge profiles without the need for expensive dies and punches. Such precision and efficiency make MLT a preferred choice for manufacturers looking to optimize their production processes.
MLT's laser skiving services further demonstrate their ability to perform controlled material removal to specific depths or targeted layers. This capability is crucial for applications requiring cavity formation, floating contacts, and selective soldermask removal, among others. By leveraging these advanced techniques, MLT helps manufacturers achieve intricate designs and functionalities that are essential in today's high-tech industry.
Beyond manufacturing, MLT offers precision laser rework and recovery services to address non-conforming products, minimizing scrap and ensuring timely deliveries. Their laser marking services, utilizing both ultraviolet and infrared lasers, produce permanent, high-resolution markings compliant with industry standards such as MIL-STD-130M for defense and SEMI M12/M13 for semiconductors. This ensures that all products not only meet but exceed industry expectations for quality and durability.
Overall, Micron Laser Technology provides a suite of laser services that are integral to the success of circuit board manufacturers. Their commitment to precision, quality, and innovation makes them a leader in the field, offering solutions that are both effective and efficient for a wide range of applications.
Laser Marking
Specifications |
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|---|---|
| Type Of Service: | Concept development, Engineering design |
| Minimum Laser Via Diameter: | 30um |
| Laser Routing Tolerance: | 25um or better |
| Infrared (CO2) Tolerance: | +/-.002” (50um) |
| Ultraviolet (UV) Tolerance: | +/-.001” (25um) |
| Serialization Tolerance: | Up to 10um |
Features
- Comprehensive PCB Laser Services: From single-sided to multi-layer, rigid, and flexible circuits, MLT offers a cost-effective, outsourced solution for circuit board manufacturers.
- Microvia Drilling: Provides laser drilling for both copper clad and unclad laminates to IPC high-density interconnect standards, with laser vias as small as 30um in diameter.
- Laser Routing: Achieve precision with 25um or better tolerances, minimal visual discoloration, radius-free internal edge profiles, and no mechanical stresses. Ideal for applications like excising, depaneling, and thermal management preforms.
- Laser Skiving: Allows controlled material removal to a limited depth or targeted layer, suitable for cavity formation, floating contacts, and selective soldermask removal.
- PCB Laser Rework: Offers precision rework and recovery services to minimize scrap and ensure timely deliveries, including solder mask removal and pad isolation.
- Laser Marking, Barcodes, and Serialization: Utilizes ultraviolet and infrared lasers for permanent, high-resolution markings compliant with MIL-STD-130M and SEMI M12/M13 standards.
- Laser Service Advantages: Offers positional and dimensional tolerances with infrared (CO2) at +/-.002” (50um) and ultraviolet (UV) at +/-.001” (25um).
- Diverse PCB Materials: Compatible with a wide range of materials including FR4, Isola, Rogers, Duroid, Teflon, Kapton, and more.
- Industry Certifications: AS9100 Certified and ITAR Registered, ensuring high standards and compliance.
Applications
- HDI PCB Manufacturing: Microvia drilling and routing for high-density circuits
- Depaneling & Excising: Efficient routing and scoring without mechanical stress
- Circuit Formation & Isolation: Skiving for selective material removal
- Soldermask & Pad Rework: Recovery of non-conforming boards to minimize scrap
- BGA & SMT Repair: Trace trimming, gold plating correction, and pad isolation
- Permanent Part Marking: Logos, barcodes, and serialization for compliance
Frequently Asked Questions
Laser Marking provides high-contrast, permanent marks with low part stress. It also offers flexibility for on-the-fly changes, accuracy, repeatability, and the ability to process curved surfaces.
Laser Marking can be used for marking logos, barcodes, and serialization. It is commonly used in the printed circuit board industry for microvia drilling, laser routing, and laser skiving. It can also be used for laser rework and recovery services.
Markings produced by Laser Marking are compliant to standards MIL-STD-130M for defense and SEMI M12/M13 for semiconductors.
Laser Marking is a process that utilizes both ultraviolet and infrared lasers to produce permanent, non-contact markings without masks or stencils.
Laser Marking can be used on a variety of materials including Stainless, Quartz, Teflon, Delrin, Plastics, Metals, Ceramic, and Anodized Aluminum.