Specifications

Type Of Service: Concept development, Engineering design
Minimum Laser Via Diameter: 30um
Laser Routing Tolerance: 25um or better
Infrared (CO2) Tolerance: +/-.002” (50um)
Ultraviolet (UV) Tolerance: +/-.001” (25um)
Serialization Tolerance: Up to 10um
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Features


  • Comprehensive PCB Laser Services: From single-sided to multi-layer, rigid, and flexible circuits, MLT offers a cost-effective, outsourced solution for circuit board manufacturers.

  • Microvia Drilling: Provides laser drilling for both copper clad and unclad laminates to IPC high-density interconnect standards, with laser vias as small as 30um in diameter.

  • Laser Routing: Achieve precision with 25um or better tolerances, minimal visual discoloration, radius-free internal edge profiles, and no mechanical stresses. Ideal for applications like excising, depaneling, and thermal management preforms.

  • Laser Skiving: Allows controlled material removal to a limited depth or targeted layer, suitable for cavity formation, floating contacts, and selective soldermask removal.

  • PCB Laser Rework: Offers precision rework and recovery services to minimize scrap and ensure timely deliveries, including solder mask removal and pad isolation.

  • Laser Marking, Barcodes, and Serialization: Utilizes ultraviolet and infrared lasers for permanent, high-resolution markings compliant with MIL-STD-130M and SEMI M12/M13 standards.

  • Laser Service Advantages: Offers positional and dimensional tolerances with infrared (CO2) at +/-.002” (50um) and ultraviolet (UV) at +/-.001” (25um).

  • Diverse PCB Materials: Compatible with a wide range of materials including FR4, Isola, Rogers, Duroid, Teflon, Kapton, and more.

  • Industry Certifications: AS9100 Certified and ITAR Registered, ensuring high standards and compliance.

Applications


  • HDI PCB Manufacturing: Microvia drilling and routing for high-density circuits

  • Depaneling & Excising: Efficient routing and scoring without mechanical stress

  • Circuit Formation & Isolation: Skiving for selective material removal

  • Soldermask & Pad Rework: Recovery of non-conforming boards to minimize scrap

  • BGA & SMT Repair: Trace trimming, gold plating correction, and pad isolation

  • Permanent Part Marking: Logos, barcodes, and serialization for compliance