HERCULES Lithography Track System
Description
HERCULES Lithography Track System
Specifications |
|
|---|---|
| Printing Technology: | Grayscale Lithography |
| Min XY Feature Size: | 500 nm |
| Min Vertical Step: | 1000 nm |
| Min Surface Roughness: | 2000 nm |
| Area Printing Speed: | -- mm^2/h |
Features
- Fully automated lithography track system based on modular design for mask
alignment and exposure with integrated pre- and post-processing - Wafer processing with high throughput
- Up to 8 wet-processing modules plus up to 24 additional bake, chill and vapor
prime plates - Mask alignment and exposure based on EVG’s IQ Aligner® NT or EVG®6200 NT
technology - Chemistry handling in separate cabinet
- Supporting Continuous Mode of Operation (CMO)
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Austria
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The HERCULES Lithography Track System is a high-volume platform that integrates the entire lithography process flow in one system. It combines optical mask alignment technology with wafer cleaning, resist coating, baking, and resist development modules.
The HERCULES can process various wafer sizes, including thick, highly bowed, rectangular, small-diameter wafers, and even device trays.
The HERCULES can coat sub-micron to ultra-thick (up to 300 microns) resists for interlayer and passivation applications.
The HERCULES has high throughput capabilities for efficient wafer processing.
The key features of the HERCULES include fully automated processing, modular design, mask alignment and exposure based on EVG's technology, up to 8 wet-processing modules, and support for continuous mode of operation.