EVG101 Advanced Resist Processing System
Description
The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.
EVG101 Advanced Resist Processing System
Specifications |
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|---|---|
| Printing Technology: | Grayscale Lithography |
| Min XY Feature Size: | -- nm |
| Min Vertical Step: | -- nm |
| Min Surface Roughness: | -- nm |
| Area Printing Speed: | -- mm^2/h |
Features
Flexible single chamber design for R&D and small-scale production
Semi-automated from two inches up to 300 mm
No or very short tooling time when changing substrate size or shape
Recipe-based automated coating and developing for best repeatability
Reliable system design with minimized footprint
Easy process transfer from research to production utilizing proven modular design
Spin and spray coating in one chamber
Recipe-controlled syringe system for R&D and sensitive resists (e.g. BCB)
Optional ISO 3 (according to ISO 14644) mini-environment
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How to order?
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Ships from:
Austria
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
The EVG101 resist processing system supports wafers up to 300 mm in size.
Yes, the EVG101 can be configured for both spin and spray coating.
Some features of the EVG101 resist processing system include a flexible single chamber design, recipe-based automated coating and developing, and a reliable system design with a minimized footprint.
Yes, the EVG101 supports 3D structured wafers for interconnection techniques with EVG's advanced OmniSpray coating technology.
Some options available for the EVG101 resist processing system include uniform coating of high-topography wafer surfaces with OmniSpray coating technology, wax and epoxy coating for subsequent bonding processes, and Spin-On-Glass (SOG) coating.