OZPEN™ CO2 Fiber Optics Cleaning Unit for High Power Components

Description

The OZPEN™ CO2 Fiber Optics Cleaning Unit is a state-of-the-art solution engineered for the precision cleaning of high-power fiber optic components and other sensitive surfaces. Designed specifically for environments where cleanliness is paramount, this unit utilizes a patented composite spray technique that combines clean, dry air or nitrogen with fine CO2 particles. This innovative approach ensures the effective removal of dust, polishing compounds, fingerprints, surface films, and other contaminants without the drawbacks commonly associated with traditional solvent-based cleaning methods.

Unlike conventional solvent wiping, which can smear or redeposit residues, the OZPEN™ delivers a controlled, high-velocity stream of solid CO2 particles—often referred to as "CO2 snow." This process leverages momentum transfer, where the impact of CO2 particles dislodges contaminants from the substrate, and the accompanying gas plume carries them away. The result is a dry, residue-free surface, making the OZPEN™ ideal for applications requiring the utmost precision, such as fiber optic connector cleaning, photonics manufacturing, and laboratory environments.

The cleaning unit is particularly effective for small surface areas and is compatible with a variety of substrates, including glass and metal. Its solvent-free operation not only eliminates the risk of chemical residues but also provides a quick-drying process, reducing downtime and increasing throughput. The system's versatility extends to the removal of both inorganic and organic contaminants, with the ability to freeze and fracture water-rich debris due to the low temperature of the CO2 spray (approximately -78°C).

Each OZPEN™ unit comes equipped with a flexible coaxial tube, a precision spray pen applicator, and a foot switch for hands-free operation. This comprehensive setup ensures users can achieve meticulous cleaning results straight out of the box, making it a more economical and adaptable alternative to traditional snow guns and enclosed cleaning systems. Whether used as a standalone solution or to augment existing cleaning protocols, the OZPEN™ CO2 Fiber Optics Cleaning Unit sets a new standard for efficiency, safety, and reliability in high-power optical component maintenance.

Specifications

Use Of Alcohol For Cleaning:	No
Voltage Requirements:	110, 230 V
Cleaning Agent Supply:	Liquid CO2, 650-950 psi, 50-75°F
Propellant Supply:	N2, CDA gas, 70-150 psi
Spray Control:	Foot switch
Maximum Environmental Temp.:	80 °F
Workspace (spray Generator):	12.5x10x5.5 inches
Fluid Filtration:	0.5 micron (standard)
Particle Capillary:	Size 20 (fine) installed (0.02”)
CO2 Connection:	Country Connector type
Propellant Gas/ Nitrogen:	USA/Canada CGA 580, UK BS 341-No3 G, Germany DIN 477-No10 W, Italy UNI 4409 W, Netherlands RU 3 W
N2 Usage:	10-15 SCFM
CO2 (liquid) Usage:	2.5-3.5 kg/hour

Got questions about specs? Use the inquiry form to ask.

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Features

Superior Residue Removal: Effectively eliminates dust, polishing compounds, fingerprints, surface films, and other contaminants from fiber optics and high power components.
Solvent-Free, Quick-Dry Cleaning: Utilizes a dry CO2 composite spray for fast, residue-free cleaning without the need for solvents or wet techniques.
Precision Cleaning for Small Areas: Designed specifically for cleaning small, critical surface areas in fiber optics and other sensitive manufacturing operations.
Patented Composite Spray Technology: Delivers a controlled, high-velocity stream of solid CO2 particles for efficient removal of both inorganic and organic contaminants, including particles smaller than 100 nm.
Versatile Substrate Compatibility: Safely cleans a variety of substrates such as glass, metal, and more, making it suitable for diverse applications.
Economical & Versatile Alternative: More cost-effective and flexible than traditional snow guns with enclosures and conventional solvent wiping methods.
Minimizes Cross-Contamination: Dry process prevents smearing, redepositing, or shedding of residues, unlike solvent-based cleaning techniques.
Adjustable Cleaning Parameters: Features adjustable nozzle, propellant pressure, and temperature for optimal cleaning performance tailored to specific needs.
Integrated System Components: Includes a flexible coaxial tube, spray pen applicator, and foot switch for ergonomic, hands-free operation.
Safe for High Power Applications: Engineered for use with high power fiber optic components, ensuring reliable and safe cleaning without damaging sensitive surfaces.
Effective Organic Contaminant Removal: Capable of removing thin film organic contamination, including light oils soluble in liquid CO2.
Low Temperature Cleaning: Solid CO2 spray operates at approximately -78°C, enabling removal of high water content contaminants by freezing and fracturing.

Applications

Fiber Optic Connector and Ferrule Cleaning
Ideal for removing dust, polishing compounds, fingerprints, and other residues from fiber optic connectors, ferrules, and end faces, ensuring optimal signal transmission and minimizing insertion loss in high-power fiber optic systems.
High Power Laser Optics Maintenance
Essential for cleaning lenses, mirrors, and other optical components in high-power laser systems, preventing damage from contaminants and maintaining peak optical performance.
Precision Cleaning in Photonics Manufacturing
Used in the production and assembly of photonics devices, such as waveguides, modulators, and detectors, to remove sub-micron particles and films without leaving residues.
Semiconductor Wafer and Mask Cleaning
Effective for cleaning semiconductor wafers, photomasks, and reticles, where even the smallest particles can cause defects in microfabrication processes.
Cleaning of Medical and Biotech Optical Instruments
Suitable for maintaining cleanliness of fiber optic tools, endoscopes, and other sensitive medical devices, ensuring sterility and performance without introducing solvents.
Telecommunications Equipment Maintenance
Used for cleaning fiber optic transceivers, patch panels, and splicing equipment in telecom networks, reducing signal loss and equipment downtime.
Laboratory and Research Applications
Perfect for cleaning sensitive optical components, sensors, and experimental setups in research labs, where contamination control is critical.
Cleaning of Glass and Metal Substrates
Removes dust, polishing residues, and thin films from glass slides, metal mirrors, and other substrates used in optics, electronics, and analytical instrumentation.
Maintenance of Aerospace and Defense Optical Systems
Applied in the cleaning of optical sensors, targeting systems, and fiber optic assemblies in aerospace and defense applications, where reliability is paramount.
Preparation of Surfaces for Coating or Bonding
Ensures surfaces are free from contaminants before applying optical coatings, adhesives, or soldering, improving adhesion and coating quality.
Cleaning of High-Power LED and Laser Diode Assemblies
Removes residues and particles from LED and laser diode modules, preventing performance degradation and extending device lifespan.
Maintenance of Cleanroom Environments
Supports contamination control protocols by providing a solvent-free, residue-free cleaning method for critical surfaces and tools in cleanrooms.

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Frequently Asked Questions

What is the OZPEN™ CO2 Fiber Optics Cleaning Unit used for?

The OZPEN™ CO2 Fiber Optics Cleaning Unit is designed for precision cleaning of fiber optics and other high power components. It efficiently removes dust, polishing compounds, fingerprints, surface films, and other residues from small surface areas, making it ideal for critical manufacturing operations involving glass, metal, and other substrates.

How does the OZPEN™ CO2 cleaning process work?

The OZPEN™ uses a patented composite spray technique that propels a controlled stream of solid CO2 particles (snow) mixed with clean dry air or nitrogen. These high-velocity CO2 particles strike contaminants on the surface, transferring momentum to dislodge them, while the CO2 gas plume carries them away. This dry process is highly effective for removing both inorganic and organic contaminants without the need for solvents.

What are the advantages of using the OZPEN™ over traditional solvent cleaning methods?

The OZPEN™ offers several advantages over traditional solvent cleaning, including a quick-dry, solvent-free process that avoids smearing or redepositing residues. It is more economical and versatile than snow guns with enclosures, and it can remove very small particles (less than 100 nm) without wet cleaning, making it superior for high power and sensitive applications.

Can the OZPEN™ CO2 cleaning unit be used on different types of surfaces?

Yes, the OZPEN™ is versatile and can clean a variety of substrates such as glass, metal, and other materials commonly found in fiber optics and high power components. It is effective at removing both particulate and thin film organic contamination, provided the organic species are soluble in liquid CO2.

Is the OZPEN™ CO2 cleaning process safe for delicate fiber optic components?

Yes, the OZPEN™ is specifically designed for precision cleaning of delicate components. The controlled CO2 snow cleaning process is non-abrasive, chemically inert, and does not leave residues, making it safe for sensitive fiber optics and high power components.

What types of contaminants can the OZPEN™ remove?

The OZPEN™ can remove a wide range of contaminants, including dust particles, polishing compounds, fingerprints, surface films, and other residues. It is also effective at removing thin film organic contamination and contaminants with high water content by freezing and fracturing them from the substrate.

Are there any cleaning limitations with the OZPEN™ CO2 unit?

While the OZPEN™ is highly effective for most surface contaminants, embedded debris may require pre-cleaning with ultrasonic methods. Additionally, only organic contaminants that are soluble in liquid CO2 can be fully removed using this system.

Got more questions? Use the inquiry form to ask the supplier directly.