LASER AND PHOTO DIODE SUB-MOUNTS
Description
Remtec manufactures High performance metallized laser and photo diode submounts, accessory circuits and spacers to customer specification. Remtec’s submounts are produced on BeO and AIN ceramics usingPCTF® (Plated Copper on Thick Film) metallization. For less thermally demanding applications, alumina based materials are available. PCTF® manufacturing technology and processes enable Remtec to offer lower cost laser diode submounts without any compromise in performance or quality. Remtec’s high performance laser diode submounts offer copper metallization with a unique Zero Pullback® from a burr‐free ceramic edge for various demanding optoelectronic applications. AZero Pullback® metallization with burr‐free edge greatly enhances performance characteristics of edge emitting diodes.
LASER AND PHOTO DIODE SUB-MOUNTS
Applications
Thick or Thin films with 25‐ 75μm Plated Copper
Direct Bond Copper 76‐ 300µm copper
Selective Copper and Gold Plating Metallization
Finish: Ni/Au and/or Au/Sn Plating
Three‐sided Metallization
Plated Through Holes and Solid Plugged Via Fills
Zero Pullback® Metallization of 25‐75μm Plated Copper
Wire Bondable and Solderable
For pricing, technical or any other questions please contact the supplier
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United States
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Frequently Asked Questions
Remtec's submounts are produced on BeO and AIN ceramics using PCTF® (Plated Copper on Thick Film) metallization. For less thermally demanding applications, alumina based materials are available.
Remtec offers Ni/Au and/or Au/Sn plating finishes. Gold‐tin plating finish can also be selectively applied over basic metallization.
DBC (Direct Bond Copper) metallization has been introduced as an additional option for specialty applications. It combines elements of thick and thin films with plated copper and nickel/gold finish.
Zero Pullback® metallization with burr‐free edge greatly enhances performance characteristics of edge emitting diodes.
The total thickness tolerance is ± 20μm.