UV Laser Depaneling Machine For PCB - FPC - Printed Circuit Board YSV-6A
Description
This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.
UV Laser Depaneling Machine For PCB - FPC - Printed Circuit Board YSV-6A
Specifications |
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|---|---|
| Work Area / Panel Length: | 300 mm |
| Work Area / Panel Width: | 300 mm |
| Work Area / Panel Thickness (Max): | 11 mm |
| Scan Field: | Not specified |
| Scan Speed: | -- mm/sec |
| Laser Output Power: | -- W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | 25 um |
| Panel Material: | FR4, FPCB, Rigid PCB, Double-Sided PCB |
Features
- The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
- In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
- The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
- The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
- The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.
- Processing Flat Substrates
Applications
- Complex contours
- No substrate brackets or cutting tools
- More panels on the base material
- Perforations and decaps
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
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On FindLight:
External Vendor
Claim YUSH Electronic Technology Co.,Ltd Page to edit and add data
Frequently Asked Questions
The UV Laser Depaneling Machine is used for cutting assembled PCBs, flexible PCBs, and cover layers.
The laser process is completely software-controlled, allowing for easy adaptation to varying materials and cutting contours.
No, laser cutting with the UV laser does not cause any appreciable mechanical or thermal stresses.
The system software differentiates between production and setting up processes, reducing instances of faulty operation.
The UV Laser Depaneling Machine allows for more components to be placed on a panel due to its minimal cutting channel requirement.