PCB Laser Depaneling Machines PCB Separator
Description
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depaneling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage.
This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods. Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry.
A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
PCB Laser Depaneling Machines PCB Separator
Specifications |
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|---|---|
| Work Area / Panel Length: | 460 mm |
| Work Area / Panel Width: | 460 mm |
| Work Area / Panel Thickness (Max): | -- mm |
| Scan Field: | Other (see specs) |
| Scan Speed: | 2500 mm/sec |
| Laser Output Power: | 17 W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | 2 um |
| Panel Material: | FPCB, Rigid PCB, Double-Sided PCB |
| Galvanometer Working Field Per One Process: | 40 mm х 40 mm |
Features
- More quick and easy, shorten the delivery time
- High quality no distortion surface clean& uniformity
- Leverage CNC software that ensures high accuracy and high speed.
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
China
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Sold by:
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On FindLight:
External Vendor
Claim ChuangWei Electronic Equipment Manufactory Page to edit and add data
Frequently Asked Questions
Laser depaneling machines provide a non-contact method of singulation without causing any mechanical stress to the parts, resulting in lower breakage and higher throughput. They also eliminate the need for tooling and waste removal associated with mechanical methods.
Yes, laser depaneling machines can cut flexible circuits without damaging the sensitive circuitry. They provide a highly precise way of singulation without any risk of harming the delicate systems on the boards.
The positioning precision of the worktable of a laser depaneling machine is ±2μm for linear motor.
Laser PCB depaneling/singulation offers several advantages, including no mechanical stress on substrates or circuits, no tooling cost or consumables, versatility in changing applications by simply changing settings, and the ability for fiducial recognition for more precise and clean cuts.
Yes, laser depaneling machines can be customized for different working fields. The effective working field is 460mmX460mm, but it can be adjusted to meet specific requirements.