Frequently Asked Questions

The standard thicknesses of the aluminum nitride substrates are .025 inches and .040 inches.

The aluminum nitride substrates are produced using tape casting or dry pressing methods.

The aluminum nitride substrates are compatible with mechanical dicing, laser scribing and cutting, thick film hybrid metallizing, thick film refractory metallizing, thin film metallizing, and direct bond copper processes.

The aluminum nitride substrates have high conductivity, low expansion, dielectric properties, low cost, and fast delivery.

The isostatically pressed aluminum nitride components are available with up to 2 inch cross section and 8 inch length as bars, rods, and tiles.

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