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Frequently Asked Questions

The DFL7560L Laser Lift-Off Machine is used for laser dicing, stealth dicing, and wafer-die separation (singulation).

The DFL7560L Laser Lift-Off Equipment offers reduced wafer damage and separation due to its wide focal point range and optimum power. It also provides extremely low surface roughness after sapphire separation.

The DFL7560L achieves high processing speed and quality by using a DPSS (solid state) laser and optics uniquely developed by DISCO.

The DFL7560L requires drastically reduced maintenance time and provides more stable processing quality compared to general separation equipment using gas lasers.

The DFL7560L can handle workpieces up to Φ150 mm in size.

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