The UV Laser Marking Machine MY-UV03 is a state-of-the-art device that incorporates the advanced INNGU UV Laser source, utilizing third-order cavity frequency doubling technology. Unlike infrared lasers, this machine operates at a wavelength of 355nm, providing a smaller spot size and greater focal depth. The short wavelength of the UV laser is capable of interrupting molecular chains within materials, which significantly reduces mechanical deformation and temperature distortion. This makes it a "cold laser," ideal for super precise marking and engraving tasks.

One of the standout features of the UV Laser Marking Machine is its ability to perform with extraordinary precision, making it particularly suitable for sectors that demand high accuracy, such as food and pharmaceutical packaging. The machine's capability to create micro porous structures and execute high-speed divisions on glass, as well as complex graphics wafer cutting on silicon materials, underscores its versatility and precision. The UV laser beam is generated after a high-power multimode diode is pumped and frequency doubled, allowing for highly controlled marking through a computer-operated high-speed scanning galvanometer.

With its high-quality laser beam and small spot size, the UV Laser Marking Machine ensures super precise marking and engraving. The cold laser technology minimizes the heat-affected zone, ensuring that materials are not burned or deformed during the marking process. This machine is not only efficient and stable but also compact and energy-efficient, making it an excellent choice for materials that are sensitive to thermal radiation. Its ability to integrate with production lines for automatic feeding and discharge of materials further enhances its industrial applicability.