Expert Sapphire Cutting and Drilling Services for Microfluidic and Sensor Applications

Specifications

Minimum Feature Size: 0.01 mm
Shape Options: Circles, triangles, rectangles, hexagons, polygons, or custom CAD shapes
Tolerance Range: 5 to 20 micrometers
Cutting Technologies: CNC, ultrasonic, laser, chemical etching
Polishing Quality: High-quality edge and surface finish
Material Options: Raw sapphire material and wafers of different polishing requirements
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Features

  • Precision Micro-Machining: Advanced techniques for high accuracy and minimal chipping
  • Custom Shapes: Circles, triangles, rectangles, hexagons, polygons, or any CAD design
  • Tight Tolerances: Ranging from 5 to 20 micrometers depending on dimensions
  • Versatile Cutting Technologies: CNC, ultrasonic, laser, and chemical etching
  • High-Quality Polishing: Superior edge quality and surface finish
  • Rapid Turnaround: Fast delivery times, typically 1-2 weeks

Applications

  • LED Packaging: Precision substrates for high-performance LED applications
  • Watch Covers: Durable, scratch-resistant sapphire covers
  • Medical Devices: High-precision components for medical instruments
  • Scientific Instruments: Custom parts for laboratory and research equipment
  • Aerospace and Defense: Robust components for harsh environments
  • Microfluidic Devices: Customized sapphire parts for fluid control systems