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  1. Home
  2. Laser Material Processing
  3. Laser Cutters
  4. Laser Dicing Machines
  5. 220V - 50Hz

220V - 50Hz Laser Dicing Machines

AD2000T-S Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
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AD2000T-S Fully Automatic Dicing Machine
8-inches Fully Automatic Dicing Machine. Achieved smallest footprint possible utilizing our own core technology.

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 260 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
...
Data Sheet
ML301EXWH Laser Dicing Machine
TOKYO SEIMITSU CO., LTD
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ML301EXWH Laser Dicing Machine
12-inches laser dicing machine with wafer handling system and visible light microscope.It's a fully integrated system that offers ease of operation, accuracy and high throughput.

Specifications
Wafer Size: 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 550 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 2 um
...
Data Sheet
AD3000T-PLUS Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
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AD3000T-PLUS Fully Automatic Dicing Machine
This is a Fully Automatic Dicing Machine capable of stealth dicing 12" wafers.Tokyo Seimitsu Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
...
Data Sheet
Silicon Wafer Laser Dicing and Scribing Machine
Shenzhen Beyond Laser Technology Co., Ltd
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Silicon Wafer Laser Dicing and Scribing Machine
Silicon Wafer Laser Dicing and Scribing Machine is equipped with a picosecond laser and offer a high throughput, cost effective and simple way to dice and scribe wafers with high accuracy and long term reliability.Copper laminate wafers with multi-layers of different materials with varying hardness and density is difficult to ...

Specifications
Wafer Size: 450 mm (17.7 in), 675 mm (26.6 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 650 mm
X-Axis Speed: 800 mm/s
X-Axis Resolution: -- um
...
Data Sheet
On FindLight marketplace you will find 4 different 220V - 50Hz Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different 220V - 50Hz Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.