All Categories

FILTER PRODUCTS

to
to
to
to
to
to
to
to
to
to
to
  1. Home
  2. Laser Material Processing
  3. Laser Cutters
  4. Laser Dicing Machines
  5. Not classified

Not classified Laser Dicing Machines

Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
Han's Laser Corporation
Add to watch list
Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine. The core principle of non-destructive laser cutting is laser thermal stress-controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the ...

Specifications
Wafer Size: 150 mm (~6 in), 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 150 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 120 um
...
Data Sheet
TITANIUM 5 Axis Laser Dicing Machine
OGI Systems LTD
Add to watch list
TITANIUM 5 Axis Laser Dicing Machine
Titanium is the most precise Laser Dicing Machine for ultra-hard materials and excellent to processed PCD, CBN, PCBN and CVD DIAMOND tools. With Titanium easy to create any abrasives tools for honing ring, grinding wheels, Milling Cutter, cutting inserts, Gear Cutting Tools, Chamfer & Deburring Tools, CBN Insert and more.The ...

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 200 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: -- um
...
Data Sheet
AD2000T-S Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
Add to watch list
AD2000T-S Fully Automatic Dicing Machine
8-inches Fully Automatic Dicing Machine. Achieved smallest footprint possible utilizing our own core technology.

Specifications
Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 260 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
...
Data Sheet
AD3000T-PLUS Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
Add to watch list
AD3000T-PLUS Fully Automatic Dicing Machine
This is a Fully Automatic Dicing Machine capable of stealth dicing 12" wafers.Tokyo Seimitsu Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.

Specifications
Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
...
Data Sheet
On FindLight marketplace you will find 4 different Not classified Laser Dicing Machines from suppliers around the world. With just a few clicks you can compare different Not classified Laser Dicing Machines and get accurate price quotes based on your needs and quantity required. Note that some wholesale suppliers may offer discounts for large quantities. From any product page you can directly contact any vendor within seconds.