Frequently Asked Questions

Single crystal silicon offers excellent optical transparency in the 3–5 µm range, making it ideal for mid-wave infrared (MWIR) applications. Its high thermal conductivity and low density also make it well-suited for systems that operate under varying thermal conditions or require lightweight components.

CZ (Czochralski) silicon wafers are grown using a crystal pulling method and typically contain some oxygen impurities. FZ (Float Zone) silicon wafers are purer, with fewer impurities and higher resistivity, making them suitable for high-performance optical and electronic applications. Intrinsic silicon is extremely pure and undoped, offering optimal optical properties for infrared use.

Yes, UM Optics provides full customization based on customer requirements. Parameters such as diameter, thickness, surface finish, coating, and flatness can be tailored for specific optical or mechanical needs. Drawings and detailed specs can be submitted for review.

The entire silicon wafer production process—from material growth to cutting, polishing, coating, and dicing—is conducted in-house under strict quality control protocols. Each wafer undergoes precision inspection to ensure surface flatness, dimensional accuracy, and optical performance.

Absolutely. UM Optics supports both batch production for R&D and small-scale testing, as well as large-volume manufacturing. The vertically integrated production line allows for scalable delivery while maintaining consistent quality and competitive pricing.

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