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 QuikLaze is an excellent tool for increased productivity in LCD repair, semiconductor failure analysis, and light micromachining applications. QuikLaze can dramatically improve the productivity of IC design engineers and failure analysts by providing a valuable tool for quickly removing passivation materials ...
  • Wavelength Options: 266nm, 355nm, 532nm, 1064nm
  • Travel X: 305 mm
  • Travel Y: 305 mm
  • Travel Z: 305 mm
  • Compatible Platform: Flexstage  
Data Sheet
The EzLaze Laser Cutting System is optimized for semiconductor failure analysis, design verification and Liquid Crystal Display (LCD) or Flat Panel Display (FPD) repair.EzLaze3 is able to be mounted on most major brands of FA microscopes, and allows the user to make precise cuts and selectively remove material on a microscopic ...
  • Wavelength Options: 1064nm, 532nm, 355nm, 266nm
  • Travel X: 305 mm
  • Travel Y: 305 mm
  • Travel Z: 305 mm
  • Compatible Platform: Flexstage 
Data Sheet
A precise Laser Cutting industrial solution and a Material processing development platform.
  • Wavelength Options: 266nm, 355nm, 532nm, 1064nm
  • Travel X: 305 mm
  • Travel Y: 305 mm
  • Travel Z: 305 mm
Data Sheet

Did You know?

Laser micromachining covers a wide range of scribing and drilling techniques that are based on both thermal and non-thermal modes of laser processing. Non-thermal mechanisms involve breaking chemical bonds using ultraviolet pulsed lasers. Since the pulse durations are on the order of femtoseconds (10^−15 s), collisions between material particles (10^−12–10^−14s) will not be triggered, and hence the mechanisms of interaction do not follow the laws of thermal conduction. Thermal laser machining is based on laser heating effects, and the required power density is typically 10^4 W/mm^2 for melting and 10^6 W/mm^2 for vaporization-dominated mechanisms. The corresponding beam interaction times lie around 10^−6 to 10^−8 s. Most classes of engineering materials can be machined using an appropriate laser beam: high energy, short wavelength visible and ultraviolet output from pulsed copper vapor and frequency-multiplied Nd:YAG lasers for metals, alloys and many ceramics; or the lower energy, longer wavelength radiation of pulsed red ruby far infrared CO2 lasers for some ceramics, glasses and polymers.