Custom 1064nm Fused Silica Scanning Mirror with Dielectric Coating

Specifications

Type: Mirror
Compatibility: Other / Not specified
Build Material: Fused Silica
Beam Diameter: 10mm
Size: 18.3*13*2mm
Dimension Tolerance: +0.0/-0.1mm
Wavelength: 1064nm
Coating: Dielectric Coating
Surface Quality: 60-40, 40-20, or better
Surface Flatness: λ/4 or better
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Features

  • Ultra-Low Thermal Expansion & High Stability: Adopts fused silica substrate with inherent ultra-low thermal expansion performance, which can maintain structural stability under temperature fluctuations and avoid deformation during long-term operation, ensuring consistent scanning accuracy
  • High-Power Laser Tolerance: Equipped with multi-layer dielectric coating that features excellent laser damage resistance, enabling stable operation in high-power laser scenarios (both pulsed and continuous-wave) without coating failure or performance degradation
  • Ultra-High Reflectivity & Low Optical Loss: Customized multi-layer dielectric coating design achieves ultra-high reflectivity at target wavelengths, minimizing laser energy loss and ensuring efficient beam transmission and utilization
  • Broad Wavelength Adaptability: The dielectric coating can be customized according to application requirements, adapting to ultraviolet, visible and near-infrared wavelength bands, and meeting the needs of diverse laser scanning scenarios
  • Excellent Environmental Durability: The dielectric coating has inherent corrosion resistance and anti-tarnishing properties, and the fused silica substrate is chemically stable, making the product suitable for long-term operation in harsh environments such as industrial sites and scientific research laboratories
  • Flexible Customization: Supports personalized customization according to actual application needs, including substrate size, shape, clear aperture and coating parameters, to perfectly match different scanning system configurations

Applications

  • High-Power Laser Marking & Engraving: Ideal for fiber laser (1064 nm) and green laser (532 nm) marking systems used in electronics, automotive, and jewelry manufacturing, ensuring high-precision and high-speed marking
  • Ultraviolet Laser Micromachining: Suitable for 355 nm UV laser micromachining systems in semiconductor wafer processing, PCB drilling, and micro-electromechanical systems (MEMS) fabrication, leveraging the fused silica substrate's UV transmittance and coating's high UV reflectivity
  • 3D Printing & Additive Manufacturing: Used in high-precision 3D printing systems (e.g., SLA, SLM) to control laser beam scanning trajectories, ensuring uniform material curing and high-quality print results
  • Semiconductor Lithography & Inspection: Applied in semiconductor lithography scanners and wafer inspection systems, where ultra-high precision and thermal stability are critical for ensuring chip manufacturing accuracy
  • Scientific Research & Laser Spectroscopy: Suitable for laser experimental setups, spectral analysis systems, and laser ranging equipment in academic and industrial research institutions, supporting high-precision optical measurements
  • Medical Laser Systems: Used in ophthalmic laser surgery, dermatological laser treatment, and other medical laser devices, benefiting from the mirror's high biocompatibility, stability, and low optical loss