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Page 11 - Laser Cutters

DirectLaser S6 Laser Depaneling Machine
DCT Laser Solutions GmbH
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DirectLaser S6 Laser Depaneling Machine
Laser depaneling opens up a whole new world of opportunities regarding precision, reliability, flexibility and cost efficiency of PCBs. Laser routing of populated flexible, flex-rigid and thin rigid PCBs significantly reduces the cost of your PCBs. No cutting dyes are needed for flexible PCBs. On rigid PCB panels the millimeter ...

Specifications
Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
LOW Laser Depaneling machine
Systemtechnik Hölzer GmbH
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LOW Laser Depaneling machine
The highly dynamic LOW laser depaneling machine is especially suitable for medium to high product volumes and meets growing requirements in the production process. Printed circuit boards of various materials are made using low-dust, low-stress laser sawing and milling techniques separated with maximum product flexibility, ...

Specifications
Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
IRLD Inline Rotary Laser Depaneler
GETECH
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IRLD Inline Rotary Laser Depaneler
IRLD is an inline laser depaneling machine specifically designed to depanel and/or singulate rigid and semi-flexible PCBs with high precision and repeatability. It is suitable for handling densely populated printed circuit board assemblies (PCBA) in automatic production assembly lines. The system consists of up to 4 high-speed ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 1.0 mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
...
Data Sheet
UV FPC Laser Cutting Machine PCB Laser Depaneling Services CWVC-6
ChuangWei Electronic Equipment Manufactory
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UV FPC Laser Cutting Machine PCB Laser Depaneling Services CWVC-6
Lasers are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges ...

Specifications
Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
...
Data Sheet
PCB Laser Depaneling Machines PCB Separator
ChuangWei Electronic Equipment Manufactory
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PCB Laser Depaneling Machines PCB Separator
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depaneling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical ...

Specifications
Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
...
Data Sheet
LPKF CuttingMaster 3000 Ci
LPKF Laser & Electronics AG
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LPKF CuttingMaster 3000 Ci
Characterized by its high efficiency, performance and quality of cut edges, the CuttingMaster 3000 is a depaneling machine that delivers the best results for almost any cutting task. The CuttingMaster 3000 has several variants that operate with pulse durations in the nanosecond and even picosecond range. The laser power can ...

Specifications
Work Area / Panel Length: 460 mm
Work Area / Panel Width: 305 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
DIVIDOS HIGH SPEED LASER DEPANELING SOLUTION
InnoLas Solutions GmbH
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DIVIDOS HIGH SPEED LASER DEPANELING SOLUTION
The DIVIDOS series meets all requirements for laser depaneling of rigid and flexible printed circuit boards and separates different materials extremely fast, stress-free and without residues. In the FULL CUT process (cut without webs), up to 300% more panels can be provided on a PCB and separated in this way, depending on the PCB ...

Specifications
Work Area / Panel Length: 457 mm
Work Area / Panel Width: 457 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
Control Micro Systems UV Laser Depaneler
Control Micro Systems Inc
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Control Micro Systems UV Laser Depaneler
CMS Laser has successfully developed two types of laser depaneling systems that included an in-line conveyor and a semi-automatic manual load system. Either design can be integrated with a CO2 or UV laser head depending on application requirements. Both designs include an integrated vision system, are CDRH Class I ...

Specifications
Work Area / Panel Length: 508 mm
Work Area / Panel Width: 457 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
Laser Depaneling PCB Machine HDZ- UVC3030
Han's Laser Corporation
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Laser Depaneling PCB Machine HDZ- UVC3030
Laser depaneling machine for PCB and related industry. A turn-key design. Our UV laser depaneling machine is assembled with a state-of-the-art 355nm Draco laser module, with fine-tuning, which ensures consistent, high-quality cutting on the fiberglass material (FR4) and flexible PCB. The cold working method produces small ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
...
Data Sheet
PCB Laser Depaneling System
Hylax Technology Pte Ltd
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PCB Laser Depaneling System
With the advent of new and high power plus lower cost UV lasers there is greater adoption of cutting of materials like printed circuit boards. This boards may be produced from fiber glass materials like FR4 or for thin flexible circuits they may be fabricated from polyimide or kapton. This process can now be ...

Specifications
Work Area / Panel Length: -- mm
Work Area / Panel Width: -- mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
MicroCut 1000 Offline LASER Depaneling
Martintrier Technology
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MicroCut 1000 Offline LASER Depaneling
MicroCut 1000 Offline LASER is an automatic laser depaneling system for printed circuit boards. It offers clean and stress-free detachment of individual boards from an array of boards on a large panel. 

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: 200 mm/sec
...
Data Sheet
Laser PCB Depaneling Machine
HGLaser Engineering Co,.Ltd.
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Laser PCB Depaneling Machine
Laser depaneling uses the focused high power density laser beam to irradiate workpiece. Under the laser power density exceeding a specific threshold, enough heat is absorbed by the panel which causes the panel material to form microscopic pores through a gasification process. As the laser beam passes through a predefined trajectory, ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Other (see specs)
Scan Speed: -- mm/sec
...
Data Sheet
FPC Precision Laser Depaneling Machine Series MS0404-V-B
GD HANS YUEMING LASER TECH CO.,LTD
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FPC Precision Laser Depaneling Machine Series MS0404-V-B
This precision laser cutting machine (laser depaneling machine) offers non-contact processing; it will not produce any mechanical deformation and can process arbitrarily complex graphics, while shortening delivery time. The built-in high performance CCD enable auto-location, auto-correction and i suitable for high precision ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
Aurotek Corporation
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Laser Depaneling And Marking Machine Semi-Automatic LSO 3000G
This is a dual function semi0automatic, laser depaneling and laser marking machine. It offers dust-free non-contact laser cutting and detachment of circuit boards from larger panels.

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: 50 x 50 mm^2
Scan Speed: -- mm/sec
...
Data Sheet
Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
Shenzhen Herolaser Equipment Co., Ltd.
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Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
This is a laser system that is used for depaneling, separating, and singulating of individual circuit boards from an array of many boards on one large panel. It is an alternative method with distinct advantages over other forms of PCB depaneling such as routers, dicing saws or die punches. PCB laser cutting uses a high-powered beam ...

Specifications
Work Area / Panel Length: 450 mm
Work Area / Panel Width: 450 mm
Work Area / Panel Thickness (Max): 0.4 mm
Scan Field: Not specified
Scan Speed: 2000 mm/sec
...
Data Sheet
LPKF CuttingMaster 2000 Ci
LPKF Laser & Electronics AG
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LPKF CuttingMaster 2000 Ci
This UV laser system is ideal for cutting flexible, rigid-flexible and rigid printed circuit boards. Users benefit from the advantages of laser technology: the cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress. The systems of the LPKF ...

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 250 mm
Work Area / Panel Thickness (Max): -- mm
Scan Field: Not specified
Scan Speed: -- mm/sec
...
Data Sheet
NEOCUT SHAPE Laser Depaneling Machine
Osai Automation System
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NEOCUT SHAPE Laser Depaneling Machine
This is a Laser Depaneling Machine. The flexible circuit market is primarily driven by the demand for smaller and lighter products; those FPCBs require tighter tolerances and smaller spacing to cut the board after component placement.NeoCut Shape performs highly accurate cutting operations, without mechanical ...

Specifications
Work Area / Panel Length: 480 mm
Work Area / Panel Width: 480 mm
Work Area / Panel Thickness (Max): 3.5 mm
Scan Field: 100 x 100 mm^2
Scan Speed: -- mm/sec
...
Data Sheet
POWER CUT 50HFIII Plasma Cutter
Shanghai Hugong Electric
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POWER CUT 50HFIII Plasma Cutter
Portable Plasma Cutter ●  New Generation IGBT Inverter Technology ●  Equipped with voltage protection and thermal protection ●  Easy-to-use and user-friendly control panel ●  Equipped with air pressure meter & air valve ●  Power and overload indicators ●  Steeples cutting current knob

Specifications
Materials: Stainless Steel, Galvanized Steel, Aluminum, Brass, Copper, Gold
Voltage Requirement: 230V - 50Hz, 230V - 60Hz
Plasma Gas: Air
Cutting Thickness: 20 mm
Portable: Yes
...
Data Sheet
UV Laser Drilling Machine ASIDA JG23
Guangdong Zhengye Technology Co., Ltd.
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UV Laser Drilling Machine ASIDA JG23
The machine is used in drilling though holes and blind holes of FPC flexible printed circuit board, cutting cover layer ,and cutting rigid -flexible circuit.

Specifications
Materials: Acrylic, Textile
Laser Output Power: W
Laser Type: Unspecified
Working Area: Other (see specs or inquire)
Features:
...
Data Sheet
UV Laser Drilling Machine For Blind Holes ASIDA JG23M
Guangdong Zhengye Technology Co., Ltd.
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UV Laser Drilling Machine For Blind Holes ASIDA JG23M
This UV Laser Drilling Machine is designed for drilling blind holes and open windows in copper and HDI boards.

Specifications
Materials: Acrylic, Aluminum, Brass, Concrete, Copper, Diamond, Glass, Granite, Iron, Leather, Marble, Paper, Plastic, Silver, Steel, Stone, Textile, Titan, Vinyl, Wood
Laser Output Power: -- W
Laser Type: Unspecified
Working Area: 610 x 724 mm (24" x 28.5"), 635 x 724 mm (25" x 28.5")
Features: Camera
Data Sheet
UV Laser Drilling Machine ASIDA JG22
Guangdong Zhengye Technology Co., Ltd.
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UV Laser Drilling Machine ASIDA JG22
The machine is used to drilling through holes / blind holes of FPC, and cutting coverlay ,cutting FPC，Cutting rigid-flexible circuit.

Specifications
Materials: Acrylic, Aluminum, Brass, Concrete, Copper, Diamond, Glass, Granite, Iron, Leather, Marble, Paper, Plastic, Silver, Steel, Stone, Textile, Titan, Vinyl, Wood
Laser Output Power: -- W
Laser Type: Unspecified
Working Area: 450 x 660 mm (18" x 26"), 610 x 724 mm (24" x 28.5"), 635 x 724 mm (25" x 28.5")
Features: Camera
Data Sheet
LASERTEC 130 PowerDrill
DMG MORI CO., LTD
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LASERTEC 130 PowerDrill
The LASERTEC PowerDrill series is an ultra-high-precision 5-axis laser drilling machine intended for drilling cooling air holes in the blades and vanes of aircraft engines and industrial gas turbines.The LASERTEC 130 PowerDrill is capable of machining diffusers with high precision and demonstrates outstanding performance in drilling ...

Specifications
Materials: Acrylic, Aluminum, Brass, Concrete, Copper, Diamond, Glass, Granite, Iron, Leather, Marble, Paper, Plastic, Silver, Steel, Stone, Textile, Titan, Vinyl, Wood
Laser Output Power: -- W
Laser Type: Unspecified
Working Area: Other (see specs or inquire)
Features: Camera
Data Sheet
LASERTEC 50 PowerDrill
DMG MORI CO., LTD
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LASERTEC 50 PowerDrill
The LASERTEC PowerDrill series is an ultra-high-precision 5-axis laser drilling machine intended for drilling cooling air holes in the blades and vanes of aircraft engines and industrial gas turbines.The LASERTEC 50 PowerDrill provides outstanding dynamics thanks to linear drives, and achieves 5-axis laser drilling of ...

Specifications
Materials: Acrylic, Aluminum, Brass, Concrete, Copper, Diamond, Glass, Granite, Iron, Leather, Marble, Paper, Plastic, Silver, Steel, Stone, Textile, Titan, Vinyl, Wood
Laser Output Power: -- W
Laser Type: Unspecified
Working Area: Other (see specs or inquire)
Features: Camera
Data Sheet
LASERTEC 80 PowerDrill
DMG MORI CO., LTD
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LASERTEC 80 PowerDrill
The LASERTEC PowerDrill series is an ultra-high-precision 5-axis laser drilling machine intended for drilling cooling air holes in the blades and vanes of aircraft engines and industrial gas turbines.The LASERTEC 80 PowerDrill is capable of machining diffusers with high precision and demonstrates outstanding performance in drilling ...

Specifications
Materials: Acrylic, Aluminum, Brass, Concrete, Copper, Diamond, Glass, Granite, Iron, Leather, Marble, Paper, Plastic, Silver, Steel, Stone, Textile, Titan, Vinyl, Wood
Laser Output Power: -- W
Laser Type: Unspecified
Working Area: Other (see specs or inquire)
Features: Camera
Data Sheet
Micro Multi Laser Drilling Machine
Y.A.C. HOLDINGS CO.,LTD
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Micro Multi Laser Drilling Machine
Micro Multi Laser Drilling Machine.

Specifications
Materials: Acrylic, Aluminum, Brass, Concrete, Copper, Diamond, Glass, Granite, Iron, Leather, Marble, Paper, Plastic, Silver, Steel, Stone, Textile, Titan, Vinyl, Wood
Laser Output Power: -- W
Laser Type: CO2 Laser
Working Area: Other (see specs or inquire)
Features: Camera
...
Data Sheet