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Frequently Asked Questions

The 6EZ polish module consists of three polish tables, three spindles, and an integrated post-polish cleaning module.

The 6EZ is a silicon carbide polisher developed by Revasum.

The entire process flow from wire slicing or laser splitting to EPI is synchronized to provide optimum performance and high yields at an affordable cost per wafer.

The high-pressure spray bar (pad cleaner) provides the best possible wafer-to-wafer process control.

The 6EZ is unique because it can polish and clean both faces of 50 SiC substrates sequentially, without any operator intervention.

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