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- Small Footprint High Precision Assembly Cell AL300
Small Footprint High Precision Assembly Cell AL300
OVERVIEW
Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts. The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.
SPECIFICATION
- High Voltage Range: 1 - 1 kV
- Solution Supply Rate: 1 - 1 mL/h
- Collector Rotation Speed: 1 - 1 rot/min
- X Axis Displacement Range: 1 - 1 mm
Applications
Pick and place
Die sorting
Dispensing of adhesives
UV curing
Chip to chip bonding
Chip to package assembly
KEY FEATURES
Compact footprint
Simple reconfi guration
Reduced complexity
Single task operation
Fully automatic process
Automatic calibration routine
ProcessControlMaster: Extremely powerful and versatile machine software

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