LIPS Corporation – 3D Depth Cameras

LIPS Corporation is a Taipei, Taiwan–based developer and manufacturer of 3D depth cameras, 3D sensing modules and AI-powered machine vision solutions. A team of MIT scholars founded the company in 2013. LIPS designs, calibrates and mass-produces depth cameras built on all three major 3D sensing technologies: Time-of-Flight (ToF), active stereo vision, and structured light. It also develops the middleware, SDKs and turnkey software that integrators need to bring 3D vision into production.

LIPS works with OEMs, ODMs, system integrators and enterprise customers in robotics, factory automation, smart logistics, 3D inspection, biometrics and smart buildings. Beyond its standard product line, the company offers custom 3D camera design services. These cover sensor selection, lens and optics customization, VCSEL illumination design, calibration and test, image processing on FPGA/DSP/OpenCL, and application-specific algorithms.

LIPS is a technology partner to companies including Intel, NVIDIA (Preferred Partner), Panasonic, Toshiba, Texas Instruments, Sony, Melexis, Analog Devices, Ambarella and CEVA. Its products have won the Taiwan Excellence Award (2019 and 2026), the iF Design Award, the Vision Systems Design Innovators Award, the Embedded Award 2024 and the 22nd National Innovation Award.

Product Portfolio

LIPSedge™ 3D Depth Cameras. This is a complete line of depth cameras covering all three core 3D sensing technologies:

• Active stereo (AE and S Series): ruggedized industrial models with IP67 sealing, PoE and M12 connectors. The S315 adds on-camera edge AI processing.
• Time-of-Flight (T, DL, M3 and AT Series): compact and FPGA-accelerated ToF cameras for people counting, occupancy sensing and gesture recognition.
• Structured light (L Series): compact, high-precision cameras for 3D scanning, inline inspection and eye tracking.

All models use VCSEL infrared illumination at 850 or 940 nm, and most offer global-shutter sensors.

LIPSense™ Intelligent Sensing. AI software and camera kits for 3D body pose and skeleton tracking, 3D scanning (LIPScan 3D™), 3D facial recognition and access control (LIPSFace™), and touchless gesture interfaces.

LIPSMetric™ Dimensioning. Static, handheld and vehicle dimensioning systems for parcels, pallets and irregular objects, plus the MeasureMaster SDK for custom integration.

LIPSolution™ Robotic Automation. Turnkey 3D vision for autonomous mobile robots and robotic arms. This includes the LIPSAMR™ Perception DevKit, a LiDAR-free kit built on NVIDIA Isaac™ Perceptor and Jetson Orin, with visual SLAM, collision avoidance and pedestrian detection.

Software and Integration

• LIPSedge™ SDK: one code base deploys across all LIPS cameras.
• Operating systems: Windows and Ubuntu, plus Jetson Linux; Android and macOS on request.
• Hardware platforms: Intel x86 and NVIDIA Jetson (ARM).
• Programming languages: Python, C, C++, C#, Java, Visual Basic and Flutter.
• Frameworks: OpenNI, OpenCV, ROS/ROS2, NVIDIA Isaac Sim and Isaac Perceptor, GenICam (MVTec HALCON and Aurora Vision).
• Developer resources: open documentation, GitHub code samples, and a technical support portal.
• Warranty: one-year warranty with ongoing software updates.

Applications

Robotic bin picking and pick-and-place · vision-guided robotics (VGR) · autonomous mobile robots (AMR) and visual SLAM · humanoid robots · warehouse and logistics automation · parcel, pallet and vehicle dimensioning · inline 3D inspection and quality control · 3D scanning · people counting and occupancy analytics · gesture recognition and touchless HMI · 3D facial recognition and access control · body pose and skeleton tracking · eye tracking · smart parking and smart buildings

Why Choose LIPS

• All three 3D sensing technologies in-house: ToF, active stereo and structured light under one roof.
• Proven optical engineering: VCSEL illumination at 850 and 940 nm, global-shutter sensors, and expertise in precision calibration and mass production.
• Hardware plus software: cameras ship with ready-made AI middleware, so time to deployment is shorter.
• Rugged industrial options: IP67 housings, PoE and M12 connectors for factory floors.
• Deep ecosystem support: close partnerships with NVIDIA, Intel and Ambarella.
• Customization from prototype to production: OEM/ODM camera design for specific applications.