Remtec Inc

Remtec, a pioneer in electronic packaging, excels in creating innovative ceramic solutions designed to precise specifications. With over three decades of experience, Remtec leads in thick film, direct bond copper substrates, and advanced ceramic packaging technology like Plated Copper Thick Film (PCTF®). The company's patented processes ensure uniform, reliable, and high-performance results. Remtec serves diverse industries, including military, aerospace, industrial electronics, semiconductor equipment, optoelectronics, medical instrumentation, transportation, and commercial telecom.

Their product range, utilizing PCTF® technology, includes laser & photodiode submounts, LED substrates, leadless hermetic & non-hermetic SMT packages, leadless ceramic SMT substrates & interposers, low-cost AgENIG substrates, metallized ceramic sensors, high-density thick film substrates, and DBC and AMB substrates.

Remtec's state-of-the-art facility boasts a class-100,000 clean room, on-site analysis, X-ray fluorescence, photolithography, electroplating, high-speed laser trim, and precision furnaces.

ISO 9001:2015 certified, RoHS, and ITAR compliant, Remtec, since 2004, stands as a reliable partner for ceramic and packaging needs, ensuring unparalleled quality and innovation.