Advanced Microscopy Services
Description
Advanced microscopy techniques such as SEM (Scanning Electron Microscopy), TEM (Transmission Electron Microscopy) and Dual Beam SEM are essential techniques to investigate sample microstructure, morphology, particle size, particle coatings and defects. These techniques often employ elemental mapping capabilities such as EELS (Electron Energy Loss Spectroscopy) and EDS (Energy Dispersive X-Ray Spectroscopy) which provide valuable information about elemental composition and location/distribution. EAG offers a broad range and large installed base of different microscopy tools and services to match your application, ranging from process development to failure analysis. In addition to providing high resolution imaging, our analytical capability makes us a unique partner that can help you during research, development, and analysis of failures.
Advanced Microscopy Services
Features
Metal migration: FIB cross-section and investigation by STEM/EDS
Voids: FIB cross-section and investigation by SEM
Particles: Surface imaging or FIB cross-section to investigate size, chemistry and position in the layer stack
Cracks and Delaminations: Small area FIB cross-sections or large area argon ion milled cross sections determine the location and of the delaminated interface. If needed, the interface chemistry can then be determined by TEM micro-analysis.
Thickness and Uniformity: FIB cross-section and investigation by SEM
Applications
Nanoparticles
Alloys and metals
Thin films
Coatings on glass, silicon or carbon-based substrates
Ceramics
Composite materials
IC devices
Aluminum anodization
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
-
Ships from:
United States
-
Sold by:
-
On FindLight:
External Vendor
Claim Evans Analytical Group Page to edit and add data
Frequently Asked Questions
The advanced microscopy techniques used in this product are SEM (Scanning Electron Microscopy), TEM (Transmission Electron Microscopy), and Dual Beam SEM.
Elemental mapping capabilities provide valuable information about elemental composition and location/distribution.
Some applications of this product include nanoparticles, alloys and metals, thin films, coatings on glass, silicon or carbon-based substrates, ceramics, composite materials, IC devices, and aluminum anodization.
This product can be used to investigate cracks and delaminations by performing small area FIB cross-sections or large area argon ion milled cross sections to determine the location and interface chemistry of the delaminated interface.
Advanced microscopy techniques can be used to test a wide range of materials including nanoparticles, alloys and metals, thin films, coatings on glass, silicon or carbon-based substrates, ceramics, composite materials, IC devices, and aluminum anodization.