Failure Analysis of LEDs, lasers and their driving circuitry
Description
LED and Luminaire Failure Analysis
Typical applications:
Root Cause Failure Analysis
Technology Evaluation
Supplier Qualification
Quality Documentation
Non-conformance Verification
Reliability Qualification to LM-79 and LM-80
Technology Cloning
Destructive Physical Analysis (DPA)
Intellectual Property Violation Counterfeit Detection
Failure Analysis of LEDs, lasers and their driving circuitry
Specifications |
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| Type Of Service: | Other |
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
Canada
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Sold by:
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On FindLight:
since 2020
Frequently Asked Questions
The purpose of the Failure Analysis is to determine the failure mode and root cause of failure of LEDs, lasers, and their driving circuitry.
The typical applications of the Failure Analysis include root cause failure analysis, technology evaluation, supplier qualification, quality documentation, non-conformance verification, reliability qualification to LM-79 and LM-80, technology cloning, destructive physical analysis (DPA), intellectual property violation, and counterfeit detection.
The analysis methods used in the Failure Analysis include optical inspection, pin test, cross-section analysis, and scanning electron microscopy (SEM).
The analysis found that the failed and intermittent LED's had temperature-dependent intermittent open circuits but no apparent damage at the semiconductor device level. There was a delamination of the clear epoxy molding compound from the inner surfaces of the metal reflector of the leadframe, and the die was lifted from the die attach glue line. There was no evidence of wirebond failure.
The electrical characterization confirmed that the operating voltage at a fixed current drops with temperature, suggesting that without active current regulation, these devices may run at higher currents and temperatures than intended or expected.