AlN Laser Diode Carriers - Pre-deposited AuSn
Description
For laser mounting a thin layer of vacuum-deposited AuSn can be selectively applied over conductor areas. The standard alloy ratio is nominally 76Au/24Sn, normally at ~4-5 microns thick. On reflowing, the Au in the underlying conductor and on the underside of the laser chip, combine with the pre-deposited solder to form an alloy approximating to the eutectic ratio of 80Au/20Sn. The resulting alloy flows and wets very well to both the laser and the carrier, resulting in excellent low-void joints minimising thermal resistance and hotspots. The alloy ratio can also be tailored for specific applications.
AlN Laser Diode Carriers - Pre-deposited AuSn
Features
Min. length or width: 100 µm
Thickness: 3-5 – 5.5 µm
Alignment to conductors: ±10 µm
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How to order?
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Ships from:
United Kingdom
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Sold by:
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On FindLight:
since 2020
Frequently Asked Questions
The AlN Laser Diode Carriers are used for laser mounting.
The standard alloy ratio is 76Au/24Sn.
The layer is typically 4-5 microns thick.
After reflowing, the alloy approximates to the eutectic ratio of 80Au/20Sn.
The alloy flows and wets well, resulting in excellent low-void joints and minimizing thermal resistance and hotspots.