Monaco 1035-40-40 Industrial Femtosecond Laser
Description
Monaco 1035 is an industrial femtosecond laser with a MOPA architecture. Designed for high-uptime in 24/7 applications, the laser family provides >80 μJ/pulse at 1035 nm. Standard repetition rates up to 50 MHz at 60 W enable current and future throughput requirements in materials processing and microelectronics applications. Homogeneous materials such as glass and metals, as well as complex, layered structures for the FPD and mobile markets are readily addressed with Monaco’s sub-350 fs pulsewidth. Additionally, on-the-fly tuning enables variable pulsewidths to >10 ps.
Monaco 1035-40-40 Industrial Femtosecond Laser
Specifications |
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|---|---|
| Wavelength: | 1035 nm |
| Repetition Rate: | 50 MHz |
| Output Power: | 40 W |
| Pulse Duration: | 350 fs |
Features
80 μJ/pulse for processing of high ablation threshold materials
60 W average power for high throughput
<350 fs standard pulsewidth for low HAZ machining
<!--350-->Variable pulsewidth from <350 fs to >10 ps for process tailoring
Repetition rate to 50 MHz for fast processing with polygon scanners
>320 μJ seeder burst mode for glass processing
Compact single box design for ease of integration
HALT-designed and HASS-verified to ensure quality and reliability
Applications
Glass Cutting and Welding
Thin Film/Foil Cutting
IC Package Cutting
Medical Device Manufacturing
OPA Pumping for Optogenetics
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Frequently Asked Questions
The output power of the Monaco 1035 laser is 40 W or 60 W, depending on the model.
The standard pulsewidth of the Monaco 1035 laser is less than 350 fs for low HAZ machining, but it can be variable from less than 350 fs to more than 10 ps for process tailoring.
The Monaco 1035 laser can process homogeneous materials such as glass and metals, as well as complex, layered structures for the FPD and mobile markets.
The repetition rate of the Monaco 1035 laser can be up to 50 MHz for fast processing with polygon scanners.
The Monaco 1035 laser is suitable for glass cutting and welding, thin film/foil cutting, IC package cutting, medical device manufacturing, and OPA pumping for optogenetics.