Blade Series Ultrafast Fiber Lasers
Description
NPI’s Blade series ultrafast fiber laser is industrial grade ultrafast laser with high stability and reliability. Its single pulse energy is up to >50 μJ and pulse width is <15 ps. It is the most popular laser light source in ultrafast precision micro fabrication.
Blade series ultrafast fiber lasers are mainly used in microelectronics processing of 3C products, mobile panels and OLED components, semiconductor wafer dicing, cutting and drilling of metal and hard brittle materials such as stainless steel, glass, sapphire and ceramics.
Different from other hot processing of long pulse lasers (such as nanosecond laser) or CW lasers, when the pulse width of ultrafast laser is short enough (<15 ps), the effect on material will cross the “hot processing” stage into the “cold processing”. The heat will disappear before spreading to the micromachining area, which can avoid recasting, micro cracks and molten particles spatter. This ensures that the physical and chemical properties of material are not affected during micro-processing in machining edge area.
Blade Series Ultrafast Fiber Lasers
Specifications |
|
|---|---|
| Wavelength: | 1064 nm |
| Repetition Rate: | 1 MHz |
| Output Power: | 10 W |
| Pulse Duration: | 15000 fs |
| Peak Power: | >3 MW |
| Single Pulse Energy: | 10 μJ |
| Operating Temperature: | 15-35 °C |
| Power Requirement: | AC 100-240 V (50 Hz/60 Hz) |
| Dimensions: | 548 x 409 x 154 mm |
| Weight: | 25 kg |
| Output Fiber Type: | Armored cable |
Features
Picosecond level
Linearly polarized
Diffraction limited beam
Tune-key system
Applications
Solar cell film cutting
Glass film cutting
Precision marking
For pricing, technical or any other questions please contact the supplier
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How to order?
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Ships from:
China
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Sold by:
NPI Lasers -
On FindLight:
since 2017
Frequently Asked Questions
The Blade series ultrafast fiber laser is mainly used in microelectronics processing of 3C products, mobile panels and OLED components, semiconductor wafer dicing, cutting and drilling of metal and hard brittle materials such as stainless steel, glass, sapphire and ceramics.
The pulse width of the Blade series ultrafast fiber laser is <15 ps.
The single pulse energy of the Blade series ultrafast fiber laser is up to >50 μJ.
The Blade series ultrafast fiber laser is different from other long pulse lasers because when the pulse width of ultrafast laser is short enough (<15 ps), the effect on material will cross the “hot processing” stage into the “cold processing”. The heat will disappear before spreading to the micromachining area, which can avoid recasting, micro cracks and molten particles spatter.
The Blade series ultrafast fiber laser is used for silicon wafer processing, solar cell film cutting, glass film cutting, and precision marking.