Ultrashort Pulse Compact Laser Processing Workstation (micar C-Baureihe)
Description
Ultrashort Pulse Compact Laser Processing Workstation (micar C-Baureihe)
Specifications |
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|---|---|
| Processes: | Cutting, Drilling, Marking |
| Materials: | Metals, Polimers, Glass |
| Laser Type: | Fiber |
| Laser Safety: | Not classified |
| Work Area X: | 500 mm |
| Work Area Y: | 500 mm |
| Number Of Axes: | 3-Axis, 5-Axis |
| Beam Delivery: | Galvo Scanner |
| Features And Options: | Integrated, Multi-Axis |
For pricing, technical or any other questions please contact the supplier
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Frequently Asked Questions
The micar C554.1 has a typical volume of work of 500x500x400 mm³.
The micar C-Baureihe uses nanosecond, picosecond and femtosecond laser sources with output power of up to 400 W.
The micar C-Baureihe has a galvanometer scanner and a focusing object with wavelengths of 255nm, 532nm and 1064nm. It also has the option for multibeam processing and beam formationioning modul.
The micar C-Baureihe is a compact and modular USP laser machine system that can be adapted to individual requirements for drilling, cutting or structuring processes with ultrashort pulse lasers.
micar offers feasibility studies, application development, CAD/CAM training, remote maintenance and software development for the micar C-Baureihe.