LS3 MOTION Laser Micromachining System
Description
LS3 MOTION Laser Micromachining System
Specifications |
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|---|---|
| Materials: | Metals |
| Laser Type: | DPSS (Other) |
| Laser Wavelength: | Other / Non-Specified |
| Laser Output Power: | -- W |
| Laser Safety: | Not classified |
| Work Area X: | 300 mm |
| Work Area Y: | 300 mm |
| Processing Speed: | -- mm/sec |
| Features And Options: | Multi-Axis |
Features
- Ultra-Compact footprint
- Robust architecture
- Modular and flexible
Applications
- Laser marking
- Laser welding
- Laser engraving
- Laser cutting
- Laser drilling
- Laser structuring and texturing
- Laser thin film removal
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Belgium
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Sold by:
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On FindLight:
External Vendor
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Frequently Asked Questions
Yes, the LS3 MOTION Laser Micromachining System is modular and flexible, which means it can be customized to suit specific micromachining applications.
The LS3 MOTION Laser Micromachining System is suitable for laser marking, laser welding, laser engraving, laser cutting, laser drilling, laser structuring and texturing, and laser thin film removal.
The LS3 MOTION Laser Micromachining System has an ultra-compact footprint, a robust architecture, and is modular and flexible.
The LS3 BASIC is a version of the LS3 MOTION Laser Micromachining System that has been specifically designed for micromachining applications in an industrial environment and integrated with a complete range of laser sources.
The LS3 MOTION Laser Micromachining System is a machine designed for micromachining applications in an industrial environment.